Inventor · disambiguated record
Heeil Chae
Also filed as: CHAE HEEIL
1 granted patent·1 pending application·0 citations·filing 2012–2024
1Inventor score
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2 records- 0145US2025308765A1Loopback circuit package and manufacturing method thereofELSPES INC·Filed 2024·Application pending·0 cites
- 0225US9073830B2Compound for inhibiting 11β-hydroxy steroid dehydrogenase 1, and a pharmaceutical composition comprising the sameLEE INHEE·Filed 2012·Granted Jul 7, 2015·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →