Inventor · disambiguated record
Heung Sup Chun
Also filed as: CHUN HEUNG S · CHUN HEUNG SUP
8 granted patents·752 citations·filing 1992–1998
91Inventor score
Top patents by PatentIndex Score
8 records- 0195US6043430ABottom lead semiconductor chip packageLG SEMICON CO LTD·Filed 1998·Granted Mar 28, 2000·243 cites·13 claims
- 0294US5644169AMold and method for manufacturing a package for a semiconductor chip and the package manufactured therebyGOLD STAR ELECTRONICS·Filed 1996·Granted Jul 1, 1997·227 cites·10 claims
- 0390US5331235AMulti-chip semiconductor packageGOLD STAR ELECTRONICS·Filed 1992·Granted Jul 19, 1994·129 cites·6 claims
- 0475US5352852ACharge coupled device package with glass lidGOLD STAR ELECTRONICS·Filed 1993·Granted Oct 4, 1994·55 cites·8 claims
- 0572US5731636ASemiconductor bonding packageLG SEMICON CO LTD·Filed 1996·Granted Mar 24, 1998·34 cites·8 claims
- 0661US5572068AIntegrated double-chip semiconductor package and method for fabricating sameGOLDSTAR ELECTRON CO INC·Filed 1994·Granted Nov 5, 1996·34 cites·11 claims
- 0753US5923080ASemiconductor apparatus having a leadframe with coated leadsLG SEMICON CO LTD·Filed 1997·Granted Jul 13, 1999·19 cites·6 claims
- 0842US5849609ASemiconductor package and a method of manufacturing thereofLG SEMICON CO LTD·Filed 1995·Granted Dec 15, 1998·11 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →