Inventor · disambiguated record
Hemanth K. Dhavaleswarapu
Also filed as: DHAVALESWARAPU HEMANTH · DHAVALESWARAPU HEMANTH K · DHAVALESWARAPU HEMANTH KUMAR
12 granted patents·6 pending applications·67 citations·filing 2011–2024
88Inventor score
Files withINTEL CORP11ADVANCED MICRO DEVICES INC4DHAVALESWARAPU HEMANTH K1GARIMELLA SURESH V1LI ZHIHUA1
Top patents by PatentIndex Score
18 records- 0190US9282650B2Thermal compression bonding process cooling manifoldINTEL CORP·Filed 2013·Granted Mar 8, 2016·14 cites·13 claims
- 0290US8632670B2Controlled flow of a thin liquid film by electrowettingGARIMELLA SURESH V·Filed 2011·Granted Jan 21, 2014·31 cites·34 claims
- 0389US10580717B2Multiple-chip package with multiple thermal interface materialsINTEL CORP·Filed 2016·Granted Mar 3, 2020·11 cites·19 claims
- 0482US9748199B2Thermal compression bonding process cooling manifoldINTEL CORP·Filed 2016·Granted Aug 29, 2017·4 cites·16 claims
- 0574US9943931B2High performance transient uniform cooling solution for thermal compression bonding processINTEL CORP·Filed 2016·Granted Apr 17, 2018·2 cites·8 claims
- 0670US9735089B2Thermal management for flexible integrated circuit packagesINTEL CORP·Filed 2015·Granted Aug 15, 2017·2 cites·16 claims
- 0766US9434029B2High performance transient uniform cooling solution for thermal compression bonding processLI ZHIHUA·Filed 2011·Granted Sep 6, 2016·2 cites·36 claims
- 0861US10643938B2Standoff spacers for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2017·Granted May 5, 2020·1 cites·22 claims
- 0959US11652018B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 1057US2025112113A1Systems and methods for improving embedded substrate thermalsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1157US2025079276A1Stiffener with integrated connectorsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1256US2024234304A1Chip package with core embedded chipletADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 1352US2025118706A1Chip package with a thermal carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1447US11062970B2Heat spreader edge standoffs for managing bondline thickness in microelectronic packagesINTEL CORP·Filed 2017·Granted Jul 13, 2021·0 cites·10 claims
- 1545US9548284B2Reduced expansion thermal compression bonding process bond headINTEL CORP·Filed 2013·Granted Jan 17, 2017·0 cites·8 claims
- 1638US2015170989A1Three-dimensional (3d) integrated heat spreader for multichip packagesDHAVALESWARAPU HEMANTH K·Filed 2013·Application pending·0 cites
- 1737US11676873B2Semiconductor package having sealant bridgeINTEL CORP·Filed 2017·Granted Jun 13, 2023·0 cites·17 claims
- 1831US2019006259A1Cooling solution designs for microelectronic packagesINTEL CORP·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hemanth K. Dhavaleswarapu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →