Inventor · disambiguated record
Heon Sik Ha
Also filed as: HA HEON SIK
10 granted patents·2 pending applications·27 citations·filing 2008–2021
85Inventor score
Top patents by PatentIndex Score
12 records- 0192US11094678B2Light emitting device having insulation patternSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Aug 17, 2021·3 cites·14 claims
- 0291US11756938B2Display device having light emitting element on pair of electrodesSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Sep 12, 2023·3 cites·12 claims
- 0391US10607968B2Light emitting device having first and second electrodesSAMSUNG DISPLAY CO LTD·Filed 2018·Granted Mar 31, 2020·8 cites·13 claims
- 0489US11158693B2Display apparatus and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Oct 26, 2021·5 cites·13 claims
- 0581US10950669B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2018·Granted Mar 16, 2021·2 cites·18 claims
- 0681US9252285B2Display substrate including a thin film transistor and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2014·Granted Feb 2, 2016·6 cites·13 claims
- 0764US12004381B2Display apparatus and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·12 claims
- 0857US10475854B2Manufacturing method of display device and thin-film deposition apparatus using the sameSAMSUNG DISPLAY CO LTD·Filed 2017·Granted Nov 12, 2019·0 cites·18 claims
- 0956US2020027927A1Manufacturing method of display device and thin-film deposition apparatus using the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Application pending·0 cites
- 1051US11114472B2Thin film transistor panel, display device, and method of manufacturing the thin film transistor panelSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·16 claims
- 1150US11502216B2Method of manufacturing photo sensorSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·19 claims
- 1250US2009165722A1Apparatus for treating substrateJUSUNG ENG CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →