Inventor · disambiguated record
Heng-Chi Huang
Also filed as: HUANG HENG-CHI
10 granted patents·14 pending applications·19 citations·filing 2006–2025
82Inventor score
Files withRICHTEK TECHNOLOGY CORP17TAIWAN SEMICONDUCTOR MFG CO LTD5NAT UNIV TSING HUA1UNIV TSINGHUA1
Top patents by PatentIndex Score
24 records- 0188US7947430B2Method of forming 3D micro structures with high aspect ratiosNAT UNIV TSING HUA·Filed 2008·Granted May 24, 2011·12 cites·9 claims
- 0279US2024297138A1Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0376US12512395B2Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2024·Granted Dec 30, 2025·0 cites·7 claims
- 0476US10170429B2Method for forming package structure including intermetallic compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·3 cites·20 claims
- 0575US11984419B2Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 0673US7384729B2Method of manufacturing a LIGA mold by backside exposureUNIV TSINGHUA·Filed 2006·Granted Jun 10, 2008·4 cites·9 claims
- 0768US11469203B2Method for forming package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 0867US12300565B2Chip package unit and chip packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Granted May 13, 2025·0 cites·9 claims
- 0965US11973010B2Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2021·Granted Apr 30, 2024·0 cites·12 claims
- 1064US2025364170A1Inductor module with heat dissipation function and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1160US2025385032A1Apparatus having an inductor and a high thermal conductivity frame and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1260US2025140630A1Chip package unit and chip packaging methodRICHTEK TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1359US2025233058A1Semiconductor package structure and method of fabricating the sameRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1459US2025311249A1Chip Heat Dissipation Integrated Packaging ModuleRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1559US2025201647A1Package structureRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1658US10811377B2Package structure with a barrier layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 1758US2024203840A1Lead frame and package methodRICHTEK TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1852US2023163042A1Package structure and packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1951US11469162B2Plurality of vertical heat conduction elements attached to metal filmRICHTEK TECHNOLOGY CORP·Filed 2021·Granted Oct 11, 2022·0 cites·13 claims
- 2049US2023131821A1Heat dissipation structure and high thermal conduction elementRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2149US2023098393A1Lead frame and packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2248US2022208628A1Chip packaging structureRICHTEK TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2346US2022157622A1Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2444US2025364518A1Integrated package structure with inductor and integrated circuit and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →