Inventor · disambiguated record
Heejung Hwang
Also filed as: HWANG HEEJUNG
3 granted patents·9 pending applications·15 citations·filing 2011–2024
65Inventor score
Top patents by PatentIndex Score
12 records- 0187US9653373B2Semiconductor package including heat spreader and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 16, 2017·7 cites·8 claims
- 0283US8692349B2Semiconductor devices and methods of controlling temperature thereofKIM JAE CHOON·Filed 2011·Granted Apr 8, 2014·7 cites·35 claims
- 0369US11502059B2Semiconductor package including a thermal pillar and heat transfer filmSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 15, 2022·1 cites·20 claims
- 0458US2025118620A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0558US2024355770A1Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0657US2025062257A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0754US2024014166A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0853US2024304564A1Electronic device and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0949US2024079393A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1046US2014184312A1Semiconductor devices and methods of controlling temperature thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1144US2024234388A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1239US2014327129A1Package on package device and method of manufacturing the sameCHO EUNSEOK·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →