Inventor · disambiguated record
Helmut Kandolf
Also filed as: KANDOLF HELMUT
12 granted patents·65 citations·filing 2001–2006
88Inventor score
Files withINFINEON TECHNOLOGIES AG12
Top patents by PatentIndex Score
12 records- 0173US6577528B2Circuit configuration for controlling write and read operations in a magnetoresistive memory configurationINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 10, 2003·21 cites·11 claims
- 0265US6759874B2Electronic circuit with a driver circuitINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 6, 2004·12 cites·12 claims
- 0364US6473335B2MRAM configurationINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 29, 2002·14 cites·5 claims
- 0449US6639829B2Configuration and method for the low-loss writing of an MRAMINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 28, 2003·6 cites·24 claims
- 0544US7362650B2Memory arrangement having a plurality of RAM chipsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 22, 2008·1 cites·18 claims
- 0643US7191276B2Hub chip for one or more memory modulesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 13, 2007·0 cites·18 claims
- 0743US6618306B2Semiconductor memory device having row and column redundancy circuit and method of manufacturing the circuitINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 9, 2003·4 cites·17 claims
- 0839US6816406B2Magnetic memory configurationINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 9, 2004·2 cites·8 claims
- 0938US6657916B2Integrated memory with memory cell arrayINFINEON TECHNOLOGIES AG·Filed 2002·Granted Dec 2, 2003·2 cites·9 claims
- 1038US6459631B2Configuration for implementing redundancy for a memory chipINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 1, 2002·2 cites·5 claims
- 1135US6445607B2Method for operating an integrated memoryINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 3, 2002·1 cites·3 claims
- 1231US6515890B2Integrated semiconductor memory having memory cells with a ferroelectric memory propertyINFINEON TECHNOLOGIES AG·Filed 2001·Granted Feb 4, 2003·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →