Inventor · disambiguated record
Heebok Kang
Also filed as: KANG HEEBOK
2 granted patents·8 citations·filing 2016–2021
54Inventor score
Technology areasH10P
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0184US11742224B2Substrate chuck and substrate bonding system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·2 cites·19 claims
- 0282US10964560B2Substrate chuck and substrate bonding system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 30, 2021·6 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →