Inventor · disambiguated record
Helmut Keser
Also filed as: KESER HELMUT
6 granted patents·2 pending applications·196 citations·filing 1983–2008
85Inventor score
Top patents by PatentIndex Score
8 records- 0189US4483810AMethod for directly joining metal pieces to oxide-ceramic substratesBBC BROWN BOVERI & CIE·Filed 1983·Granted Nov 20, 1984·51 cites·15 claims
- 0280US5705853APower semiconductor moduleASEA BROWN BOVERI·Filed 1996·Granted Jan 6, 1998·81 cites·6 claims
- 0369US4650107AMethod for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrateBBC BROWN BOVERI & CIE·Filed 1985·Granted Mar 17, 1987·38 cites·5 claims
- 0456US4720469AMethod for diffusing aluminumBBC BROWN BOVERI & CIE·Filed 1986·Granted Jan 19, 1988·23 cites·19 claims
- 0544US7768139B2Power semiconductor moduleABB RESEARCH LTD·Filed 2003·Granted Aug 3, 2010·2 cites·16 claims
- 0644US2008153211A1Insulated power semiconductor module with reduced partial discharge and manufacturing methodABB REASERCH LTD·Filed 2008·Application pending·0 cites
- 0736US2006214186A1Insulated power semiconductor module with reduced partial discharge and manufacturing methodABB RESEARCH LTD·Filed 2004·Application pending·0 cites
- 0828US5063436APressure-contacted semiconductor componentASEA BROWN BOVERI·Filed 1991·Granted Nov 5, 1991·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →