Inventor · disambiguated record
Heonwoo Kim
Also filed as: KIM HEONWOO
4 granted patents·1 pending application·4 citations·filing 2021–2025
61Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0191US12327784B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 0289US11848307B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 0370US2025273554A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0455US12080691B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 0547US11881456B2Semiconductor package including an interposer disposed on a package substrate and a capping structure disposed on the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →