Inventor · disambiguated record
Heon Do Kim
Also filed as: KIM HEON D · KIM HEON DO
11 granted patents·2 pending applications·88 citations·filing 1991–2022
89Inventor score
Top patents by PatentIndex Score
13 records- 0187US10808315B2Substrate processing apparatus having exhaust gas decomposer, and exhaust gas processing method thereforJUSUNG ENG CO LTD·Filed 2016·Granted Oct 20, 2020·5 cites·10 claims
- 0270US11970770B2Substrate processing apparatus having exhaust gas decomposer, and exhaust gas processing method thereforJUSUNG ENG CO LTD·Filed 2022·Granted Apr 30, 2024·0 cites·6 claims
- 0367US11371142B2Substrate processing apparatus having exhaust gas decomposer, and exhaust gas processing method thereforJUSUNG ENG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·13 claims
- 0465US5911857AMethod for forming metal wiring of semiconductor devicesHYUNDAI ELECTRONICS IND·Filed 1997·Granted Jun 15, 1999·25 cites·20 claims
- 0561US6346478B1Method of forming a copper wiring in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2000·Granted Feb 12, 2002·8 cites·81 claims
- 0656US6423637B2Method of manufacturing copper wiring in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2001·Granted Jul 23, 2002·8 cites·13 claims
- 0751US6475913B1Method for forming damascene type of metal wires in semiconductor devicesHYUNDAI ELECTRONICS IND·Filed 2000·Granted Nov 5, 2002·5 cites·15 claims
- 0845US5490901AMethod for forming a contact hole in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1994·Granted Feb 13, 1996·15 cites·5 claims
- 0940US5200030AMethod for manufacturing a planarized metal layer for semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1991·Granted Apr 6, 1993·13 cites·21 claims
- 1038US5985758AMethod for forming metal lines of semiconductor devicesHYUNDAI ELECTRONICS IND·Filed 1997·Granted Nov 16, 1999·8 cites·20 claims
- 1136US2018254365A1Thin film type solar cell and method for manufacturing the sameMOOHAN CO LTD·Filed 2016·Application pending·0 cites
- 1234US2018033903A1Structure using a thin film type solar cellMOOHAN CO LTD·Filed 2015·Application pending·0 cites
- 1329US6316355B1Method for forming metal wire using titanium film in semiconductor device having contact holesHYUNDAI ELECTRONICS IND·Filed 1999·Granted Nov 13, 2001·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →