Inventor · disambiguated record
Heike Klein
Also filed as: KLEIN HEIKE
4 granted patents·2 citations·filing 2020–2020
58Inventor score
Technology areasB65D
Top patents by PatentIndex Score
4 records- 0174US11897671B2Flat-shaped composite material, package sleeve and package with stress-relief panelsSIG TECHNOLOGY AG·Filed 2020·Granted Feb 13, 2024·1 cites·21 claims
- 0273US12139310B2Flat-shaped composite material, package sleeve and package with curved edgesSIG SERVICES AG·Filed 2020·Granted Nov 12, 2024·1 cites·25 claims
- 0351US11912473B2Package with curved edgesSIG TECHNOLOGY AG·Filed 2020·Granted Feb 27, 2024·0 cites·19 claims
- 0450US12129085B2Package with stress-relief panelsSIG SERVICES AG·Filed 2020·Granted Oct 29, 2024·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →