Inventor · disambiguated record
Heung Cho Ko
Also filed as: KO HEUNG CHO
31 granted patents·1 pending application·3,424 citations·filing 2005–2022
98Inventor score
Files withUNIV ILLINOIS17GWANGJU INST SCIENCE & TECH5ROGERS JOHN A5KWANGJU INST SCI & TECH2NUZZO RALPH G1
Top patents by PatentIndex Score
32 records- 0199US8895406B2Release strategies for making transferable semiconductor structures, devices and device componentsROGERS JOHN A·Filed 2011·Granted Nov 25, 2014·211 cites·22 claims
- 0299US7932123B2Release strategies for making transferable semiconductor structures, devices and device componentsUNIV ILLINOIS·Filed 2007·Granted Apr 26, 2011·342 cites·41 claims
- 0398US9601671B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2015·Granted Mar 21, 2017·24 cites·20 claims
- 0498US9324733B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsUNIV ILLINOIS·Filed 2014·Granted Apr 26, 2016·71 cites·38 claims
- 0598US9117940B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2014·Granted Aug 25, 2015·52 cites·21 claims
- 0698US8905772B2Stretchable and foldable electronic devicesUNIV ILLINOIS·Filed 2013·Granted Dec 9, 2014·120 cites·27 claims
- 0798US8729524B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsROGERS JOHN A·Filed 2012·Granted May 20, 2014·148 cites·21 claims
- 0898US8722458B2Optical systems fabricated by printing-based assemblyROGERS JOHN·Filed 2011·Granted May 13, 2014·365 cites·67 claims
- 0998US8552299B2Stretchable and foldable electronic devicesROGERS JOHN A·Filed 2009·Granted Oct 8, 2013·236 cites·32 claims
- 1098US8394706B2Printable semiconductor structures and related methods of making and assemblingNUZZO RALPH G·Filed 2011·Granted Mar 12, 2013·224 cites·24 claims
- 1198US8217381B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsROGERS JOHN A·Filed 2007·Granted Jul 10, 2012·195 cites·56 claims
- 1298US8039847B2Printable semiconductor structures and related methods of making and assemblingUNIV ILLINOIS·Filed 2010·Granted Oct 18, 2011·282 cites·23 claims
- 1398US7972875B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2007·Granted Jul 5, 2011·596 cites·49 claims
- 1498US7799699B2Printable semiconductor structures and related methods of making and assemblingUNIV ILLINOIS·Filed 2006·Granted Sep 21, 2010·450 cites·41 claims
- 1597US10064269B2Stretchable and foldable electronic devicesUNIV ILLINOIS·Filed 2014·Granted Aug 28, 2018·26 cites·21 claims
- 1697US9349900B2Release strategies for making transferable semiconductor structures, devices and device componentsUNIV ILLINOIS·Filed 2014·Granted May 24, 2016·25 cites·69 claims
- 1796US10424572B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2017·Granted Sep 24, 2019·8 cites·22 claims
- 1896US10361180B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2017·Granted Jul 23, 2019·10 cites·12 claims
- 1996US10292261B2Stretchable and foldable electronic devicesUNIV ILLINOIS·Filed 2015·Granted May 14, 2019·13 cites·35 claims
- 2095US10504882B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2017·Granted Dec 10, 2019·7 cites·19 claims
- 2195US10355113B2Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsUNIV ILLINOIS·Filed 2016·Granted Jul 16, 2019·11 cites·24 claims
- 2283US11309305B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2019·Granted Apr 19, 2022·1 cites·13 claims
- 2382US12136620B2Optical systems fabricated by printing-based assemblyUNIV ILLINOIS·Filed 2022·Granted Nov 5, 2024·0 cites·17 claims
- 2468US7446166B2Pyrrole derivative and photosensitive film using the sameUNIV SOGANG IND UNIV COOP FOUN·Filed 2005·Granted Nov 4, 2008·5 cites·3 claims
- 2564US9827799B2Transfer printing substrateGWANGJU INST SCIENCE & TECH·Filed 2013·Granted Nov 28, 2017·2 cites·13 claims
- 2656US9656502B2Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereofGWANGJU INST SCIENCE & TECH·Filed 2015·Granted May 23, 2017·0 cites·5 claims
- 2751US2011316120A1Release Strategies for Making Transferable Semiconductor Structures, Devices and Device ComponentsROGERS JOHN A·Filed 2011·Application pending·0 cites
- 2849US10591272B2Strain sensor with improved sensitivityGWANGJU INST SCIENCE & TECH·Filed 2016·Granted Mar 17, 2020·0 cites·13 claims
- 2947US9005709B2Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereofKWANGJU INST SCI & TECH·Filed 2012·Granted Apr 14, 2015·0 cites·20 claims
- 3046US9368346B2Method of fabricating zinc oxide nanostructures using liquid masking layerKWANGJU INST SCI & TECH·Filed 2014·Granted Jun 14, 2016·0 cites·11 claims
- 3144US10014473B2Cilia-assisted transfer printing of electronic devicesGWANGJU INST SCIENCE & TECH·Filed 2016·Granted Jul 3, 2018·0 cites·9 claims
- 3238US11424163B2Three-dimensional electronic device through organic solvent plasticization process of polymer frame, and method for manufacturing sameGWANGJU INST SCIENCE & TECH·Filed 2019·Granted Aug 23, 2022·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →