Inventor · disambiguated record
Heinrich Koerner
Also filed as: KOERNER HEINRICH
28 granted patents·2 pending applications·173 citations·filing 1992–2020
95Inventor score
Top patents by PatentIndex Score
30 records- 0194US7948064B2System on a chip with on-chip RF shieldINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 24, 2011·29 cites·30 claims
- 0290US7936052B2On-chip RF shields with backside redistribution linesINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 3, 2011·19 cites·19 claims
- 0386US8063469B2On-chip radio frequency shield with interconnect metallizationBARTH HANS-JOACHIM·Filed 2008·Granted Nov 22, 2011·14 cites·24 claims
- 0484US8536683B2System on a chip with on-chip RF shieldBARTH HANS-JOACHIM·Filed 2011·Granted Sep 17, 2013·6 cites·31 claims
- 0582US5478780AMethod and apparatus for producing conductive layers or structures for VLSI circuitsSIEMENS AG·Filed 1992·Granted Dec 26, 1995·57 cites·3 claims
- 0681US8889548B2On-chip RF shields with backside redistribution linesBARTH HANS-JOACHIM·Filed 2011·Granted Nov 18, 2014·4 cites·29 claims
- 0780US10978418B2Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layerINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0878US10461056B2Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·2 cites·7 claims
- 0976US8748287B2System on a chip with on-chip RF shieldINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 10, 2014·3 cites·26 claims
- 1076US7667256B2Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·8 cites·17 claims
- 1173US8946074B2Method of making interconnect structureKOERNER HEINRICH·Filed 2011·Granted Feb 3, 2015·4 cites·8 claims
- 1268US12033972B2Chip package, method of forming a chip package and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·0 cites·12 claims
- 1368US9390973B2On-chip RF shields with backside redistribution linesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·1 cites·18 claims
- 1467US7656037B2Integrated circuit with improved component interconnectionsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 2, 2010·4 cites·19 claims
- 1565US9269669B2Process for producing a multifunctional dielectric layer on a substrateHELNEDER JOHANN·Filed 2012·Granted Feb 23, 2016·2 cites·18 claims
- 1665US7960832B2Integrated circuit arrangement with layer stackINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 14, 2011·3 cites·36 claims
- 1764US8049336B2Interconnect structureINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 1, 2011·2 cites·26 claims
- 1856US9263328B2Semiconductor device and method for making sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 16, 2016·0 cites·9 claims
- 1951US8994179B2Semiconductor device and method for making sameMEINHOLD DIRK·Filed 2008·Granted Mar 31, 2015·0 cites·13 claims
- 2050US9312172B2Semiconductor device and method for making sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 12, 2016·0 cites·3 claims
- 2149US9543199B2Long-term heat treated integrated circuit arrangements and methods for producing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 10, 2017·0 cites·14 claims
- 2249US8258628B2System and method for integrated circuit arrangement having a plurality of conductive structure levelsHOMMEL MARTINA·Filed 2006·Granted Sep 4, 2012·1 cites·19 claims
- 2345US10672678B2Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 2445US9941181B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 10, 2018·0 cites·13 claims
- 2544US6057229AMethod for metallizing submicron contact holes in semiconductor bodiesSIEMENS AG·Filed 1997·Granted May 2, 2000·12 cites·14 claims
- 2643US2006222760A1Process for producing a multifunctional dielectric layer on a substrateHELNEDER JOHANN·Filed 2006·Application pending·0 cites
- 2741US8643183B2Long-term heat-treated integrated circuit arrangements and methods for producing the sameAUBEL OLIVER·Filed 2006·Granted Feb 4, 2014·0 cites·17 claims
- 2840US10867893B2Semiconductor devices and methods for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 15, 2020·0 cites·26 claims
- 2939US10497634B2Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compoundINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 3, 2019·0 cites·12 claims
- 3031US2014339690A1Elimination of Die-Top DelaminationINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →