Inventor · disambiguated record
Hee Kon Lee
Also filed as: LEE HEE KON
4 granted patents·3 pending applications·42 citations·filing 2009–2011
76Inventor score
Top patents by PatentIndex Score
7 records- 0192US8830689B2Interposer-embedded printed circuit boardKIM JIN GU·Filed 2011·Granted Sep 9, 2014·19 cites·7 claims
- 0283US8704350B2Stacked wafer level package and method of manufacturing the samePARK SEUNG WOOK·Filed 2009·Granted Apr 22, 2014·11 cites·5 claims
- 0383US8658467B2Method of manufacturing stacked wafer level packagePARK SEUNG WOOK·Filed 2011·Granted Feb 25, 2014·7 cites·8 claims
- 0474US7947530B2Method of manufacturing wafer level package including coating and removing resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2009·Granted May 24, 2011·5 cites·6 claims
- 0546US2011201156A1Method of manufacturing wafer level package including coating resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 0635US2011198749A1Semiconductor chip package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 0734US2011156241A1Package substrate and method of fabricating the sameHONG JU PYO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →