Inventor · disambiguated record
Heon Lee
Also filed as: LEE HEON · LEE HEON-GWON
5 granted patents·3 pending applications·61 citations·filing 2001–2018
80Inventor score
Top patents by PatentIndex Score
8 records- 0182US6440820B1Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor waferHEWLETT PACKARD CO·Filed 2001·Granted Aug 27, 2002·16 cites·14 claims
- 0278US9000789B2Method and equipment for testing semiconductor apparatuses simultaneously and continuouslyKIM EUN-SIK·Filed 2011·Granted Apr 7, 2015·5 cites·18 claims
- 0376US6621096B2Device isolation process flow for ARS systemHEWLETT PACKARD DEVELPOMENT CO·Filed 2001·Granted Sep 16, 2003·21 cites·8 claims
- 0475US6436794B1Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor waferHEWLETT PACKARD CO·Filed 2001·Granted Aug 20, 2002·18 cites·14 claims
- 0567US10747680B2Storage device, storage system comprising the same, and operating methods of the storage deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·1 cites·15 claims
- 0648US2015198658A1Method and equipment for testing semiconductor apparatuses simultaneously and continuouslySAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 0740US2007145578A1Multi-chip package sharing temperature-compensated self-refresh signal and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0839US2003207575A1Device isolation process flow for ARS systemFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →