Inventor · disambiguated record
Heeseok Lee
Also filed as: LEE HEESEOK
32 granted patents·12 pending applications·92 citations·filing 2009–2024
95Inventor score
Top patents by PatentIndex Score
44 records- 0195US11728274B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 15, 2023·4 cites·18 claims
- 0295US11165143B2Antenna module and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 2, 2021·4 cites·20 claims
- 0391US9425156B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 23, 2016·11 cites·22 claims
- 0486US9721644B2Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 1, 2017·5 cites·20 claims
- 0586US8940584B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 27, 2015·8 cites·13 claims
- 0683US10825776B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·18 claims
- 0783US9324657B2Semiconductor package and method of fabricating the sameSEO JANGMEE·Filed 2014·Granted Apr 26, 2016·13 cites·14 claims
- 0882US11373933B2Semiconductor package including composite molding structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·1 cites·16 claims
- 0982US8330278B2Semiconductor package including a plurality of stacked semiconductor devicesLEE HEESEOK·Filed 2009·Granted Dec 11, 2012·13 cites·13 claims
- 1081US8748228B2Semiconductor packages and methods of forming the sameKIM TONGSUK·Filed 2012·Granted Jun 10, 2014·8 cites·10 claims
- 1179US9659852B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 23, 2017·4 cites·19 claims
- 1278US11502061B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 15, 2022·2 cites·20 claims
- 1378US8743560B2Circuit board and semiconductor module including the sameKIM YONGHOON·Filed 2011·Granted Jun 3, 2014·5 cites·18 claims
- 1477US12381169B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·13 claims
- 1577US8269342B2Semiconductor packages including heat slugsKIM YONGHOON·Filed 2010·Granted Sep 18, 2012·6 cites·17 claims
- 1676US12469790B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·13 claims
- 1776US10211159B2Semiconductor packages having semiconductor chips disposed in opening in shielding core plateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·2 cites·20 claims
- 1871US12451400B2Semiconductor package having improved heat dissipation characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1971US11908774B2Semiconductor package including composite molding structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·10 claims
- 2071US11837581B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 2170US9030838B2Package substrate and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 12, 2015·2 cites·13 claims
- 2262US2024150731A1Novel citrate synthase variant and method for producing l-valine using the sameCJ CHEILJEDANG CORP·Filed 2022·Application pending·0 cites
- 2360US8649186B2Package substrate and semiconductor package having the sameYOU SE-HO·Filed 2010·Granted Feb 11, 2014·1 cites·4 claims
- 2459US2025320262A1Novel variant regulator of acetate metabolism a and method of producing l-branched-chain amino acid using the sameCJ CHEILJEDANG CORP·Filed 2022·Application pending·0 cites
- 2559US2025132271A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2659US2024093163A1aroG Aldolase Variant and Method for Producing Branched Chain Amino Acids by Using SameCJ CHEILJEDANG CORP·Filed 2021·Application pending·0 cites
- 2758US2025105178A1Semiconductor chip and semiconductor package including the same, and manufacturing method of semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2858US2024384253A1Prephenate dehydratase variant and method of producing branched-chain amino acids using the sameCJ CHEILJEDANG CORP·Filed 2022·Application pending·0 cites
- 2958US2021257324A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 3057US2024352493A1Novel acetohydroxy acid synthase subunit variant and method for producing l-valine using sameCJ CHEILJEDANG CORP·Filed 2022·Application pending·0 cites
- 3156US11908758B2Semiconductor package including dual stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 3254US2023207417A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3354US2023107103A1System on chip having three-dimensional chiplet structure and electronic device including the system on chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3453US11908810B2Hybrid semiconductor device and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 3552US9830973B2Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 28, 2017·0 cites·20 claims
- 3649US12213256B2Semiconductor package for improving power integrity characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 3748US11830813B2Semiconductor devices including power connection linesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 3848US11764182B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 3944US11854985B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 4044US2020381400A1Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4143US9560767B2Wiring boards and semiconductor modules including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 31, 2017·0 cites·20 claims
- 4241US12224260B2Semiconductor package including a dualized signal wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·18 claims
- 4337US2015035148A1Semiconductor packages and methods of fabricating the sameLEE HEESEOK·Filed 2014·Application pending·0 cites
- 4436US9799591B2Semiconductor packages including thermal blocksSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →