Inventor · disambiguated record
Heonju Lee
Also filed as: LEE HEONJU
2 granted patents·1 pending application·2 citations·filing 2016–2024
35Inventor score
Top patents by PatentIndex Score
3 records- 0176US10472529B2Ink composition for powder bed and inkjet head 3D printingKOREA INST SCI & TECH·Filed 2016·Granted Nov 12, 2019·2 cites·9 claims
- 0260US2025244660A1Semiconductor device manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0344US12394666B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →