Inventor · disambiguated record
Heesoo Lee
Also filed as: LEE HEESOO
80 granted patents·102 pending applications·319 citations·filing 2003–2025
99Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST56STATS CHIPPAC PTE LTD55JCET STATS CHIPPAC KOREA LTD35KOREA ELECTRONICS TELECOMM8LEE HEESOO5
Top patents by PatentIndex Score
182 records- 0197US10797024B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 6, 2020·6 cites·25 claims
- 0297US10636765B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Apr 28, 2020·24 cites·21 claims
- 0397US8577284B2Cooperative reception diversity apparatus and method based on signal point rearrangement or superposition modulation in relay systemSEO BANGWON·Filed 2008·Granted Nov 5, 2013·103 cites·10 claims
- 0494US11990424B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2023·Granted May 21, 2024·2 cites·22 claims
- 0594US10937741B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Mar 2, 2021·10 cites·25 claims
- 0694US8593936B2Carrier aggregation in wireless communication systemsKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Nov 26, 2013·11 cites·19 claims
- 0794US8363537B2Carrier aggregation in wireless communication systemKOREA ELECTRONICS TELECOMM·Filed 2012·Granted Jan 29, 2013·11 cites·21 claims
- 0893US11189598B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2019·Granted Nov 30, 2021·7 cites·25 claims
- 0993US10468384B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 5, 2019·7 cites·24 claims
- 1092US8725067B2Self-interference cancellation method and apparatus of relay using the same frequency band in OFDM-based radio communication systemAHN JAE YOUNG·Filed 2009·Granted May 13, 2014·24 cites·8 claims
- 1191US10797039B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 6, 2020·6 cites·21 claims
- 1291US10075276B2Carrier aggregation in wireless communication systemsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted Sep 11, 2018·5 cites·37 claims
- 1391US9171739B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofROH YOUNGDAL·Filed 2014·Granted Oct 27, 2015·20 cites·20 claims
- 1490US11670618B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 6, 2023·2 cites·25 claims
- 1590US11664327B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 30, 2023·2 cites·22 claims
- 1690US10700011B2Semiconductor device and method of forming an integrated SIP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 30, 2020·7 cites·22 claims
- 1789US10636774B2Semiconductor device and method of forming a 3D integrated system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Apr 28, 2020·5 cites·23 claims
- 1889US8971168B2Carrier aggregation in wireless communications systemsKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Mar 3, 2015·6 cites·25 claims
- 1988US11769730B2Semiconductor device and method of providing high density component spacingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 26, 2023·2 cites·25 claims
- 2088US9859200B2Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2015·Granted Jan 2, 2018·8 cites·10 claims
- 2186US11804938B2Method and apparatus for transmitting scrambled data by user equipmentELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted Oct 31, 2023·1 cites·18 claims
- 2286US10938534B2Carrier aggregation in wireless communication systemsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Mar 2, 2021·2 cites·24 claims
- 2385US10636756B2Semiconductor device and method of forming protrusion E-bar for 3D SIPSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 28, 2020·4 cites·25 claims
- 2483US12512949B2Carrier aggregation in wireless communication systemsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Dec 30, 2025·0 cites·18 claims
- 2582US12385128B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·24 claims
- 2681US12046564B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2781US9693455B1Integrated circuit packaging system with plated copper posts and method of manufacture thereofPARK SEONG WON·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 2881US2025385198A1Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat DissipationJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 2980US9124313B2Multi-cell cooperative communication system and terminal deviceKO YOUNG JO·Filed 2009·Granted Sep 1, 2015·7 cites·12 claims
- 3079US12266614B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·25 claims
- 3179US2025201730A1Molded Laser Package with Electromagnetic Interference Shield and Method of MakingSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 3276US11676911B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·22 claims
- 3376US2025125233A1Integrated Antenna-In-Package StructureJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3475US11932933B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2022·Granted Mar 19, 2024·0 cites·23 claims
- 3574US12464424B2Method and apparatus for improving handover performance in communication systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Nov 4, 2025·0 cites·7 claims
- 3674US8139498B2Method and apparatus for determining reporting period of channel quality information in multi-carrier wireless systemSEO BANGWON·Filed 2007·Granted Mar 20, 2012·5 cites·17 claims
- 3774US2024089809A1Method and apparatus for handover in wireless communication systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 3873US12266587B2Semiconductor device and method for advanced thermal dissipationSTATS CHIPPAC PTE LTD·Filed 2022·Granted Apr 1, 2025·0 cites·23 claims
- 3973US12211773B2Integrated antenna-in-package structureJCET STATS CHIPPAC KOREA LTD·Filed 2022·Granted Jan 28, 2025·0 cites·25 claims
- 4073US11652088B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2021·Granted May 16, 2023·0 cites·24 claims
- 4173US9007979B2Apparatus and method for transmitting and receiving data in wireless communication system using relayLEE HEESOO·Filed 2009·Granted Apr 14, 2015·4 cites·9 claims
- 4272US12431437B2Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipationJCET STATS CHIPPAC KOREA LTD·Filed 2022·Granted Sep 30, 2025·0 cites·14 claims
- 4372US11587882B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 21, 2023·0 cites·17 claims
- 4472US2025357286A1Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect SubstrateSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 4571US12368473B2Method and apparatus for codebook design in communication systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Jul 22, 2025·0 cites·13 claims
- 4671US2025357253A1Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIMSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 4769US9385100B1Integrated circuit packaging system with surface treatment and method of manufacture thereofLEE HUN TEAK·Filed 2015·Granted Jul 5, 2016·2 cites·14 claims
- 4869US7991066B2Transmitter, receiver and method for controlling multiple input multiple output systemKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Aug 2, 2011·4 cites·17 claims
- 4969US2023402383A1Semiconductor Device and Method of Providing High Density Component SpacingSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 5069US2025201655A1Semiconductor Device and Method for Advanced Thermal DissipationSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 182 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →