Inventor · disambiguated record
Heng Chen Lee
Also filed as: LEE HENG CHEN
5 granted patents·20 citations·filing 2016–2020
74Inventor score
Technology areasH10P
Files withSEMICONDUCTOR COMPONENTS IND LLC5
Top patents by PatentIndex Score
5 records- 0194US9793186B1Semiconductor wafer and method of backside probe testing through opening in film frameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 17, 2017·12 cites·18 claims
- 0289US10461000B2Semiconductor wafer and method of probe testingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 29, 2019·6 cites·20 claims
- 0381US10170381B2Semiconductor wafer and method of backside probe testing through opening in film frameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jan 1, 2019·2 cites·20 claims
- 0461US10685891B2Semicoductor wafer and method of backside probe testing through opening in film frameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jun 16, 2020·0 cites·18 claims
- 0553US11114329B2Methods for loading or unloading substrate with evaporator planetSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Sep 7, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →