Inventor · disambiguated record
Helmut W. Leicht
Also filed as: LEICHT HELMUT · LEICHT HELMUT W · LEICHT HELMUT WALTER
10 granted patents·2 pending applications·77 citations·filing 1989–2021
88Inventor score
Files withLEICHT HELMUT W2FRAUNHOFER GES FORSCHUNG1IBL LOETTECHNIK GMBH1IBL LOTTECHNIK1LEICHT HELMUT WALTER1
Top patents by PatentIndex Score
12 records- 0157US7748600B2Process and device for soldering in the vapor phaseIBL LOETTECHNIK GMBH·Filed 2004·Granted Jul 6, 2010·9 cites·14 claims
- 0256US2023064858A1Device and method for controlled heat transfer, in particular to workpieces of large dimensions and masses by means of a condensing liquidLEICHT HELMUT WALTER·Filed 2021·Application pending·0 cites
- 0353US5181648AMethod and apparatus for vapor phase soldering and cleaning productsLEICHT HELMUT W·Filed 1989·Granted Jan 26, 1993·14 cites·29 claims
- 0450US6116497AProcess and device for the wave or vapor-phase soldering of electronic unitsFRAUNHOFER GES FORSCHUNG·Filed 1996·Granted Sep 12, 2000·17 cites·35 claims
- 0545US2010170940A1Device for Soldering in the Vapor PhaseLEICHT HELMUT W·Filed 2007·Application pending·0 cites
- 0642US5702051ADevice for moving an object by means of thermal change in shape or volumeFiled 1994·Granted Dec 30, 1997·9 cites·12 claims
- 0734US5893709AHeat-transfer device for use in a convective-heat installation, in particular in a convective soldering installationFiled 1994·Granted Apr 13, 1999·5 cites·13 claims
- 0834US5482201ATransport device and process for a vapor-phase soldering installationFiled 1993·Granted Jan 9, 1996·5 cites·18 claims
- 0931US5868297ADevice for separating components from a substrate, in particular for unsoldering electronic componentsIBL LOTTECHNIK·Filed 1996·Granted Feb 9, 1999·10 cites·11 claims
- 1031US5381945AProcess for soldering materials like printed circuit boards or sets of components in electronics or metals in engineering workFiled 1992·Granted Jan 17, 1995·4 cites·9 claims
- 1130US6443356B1Method for controlling heat transfer to a work piece during condensation solderingFiled 1999·Granted Sep 3, 2002·3 cites·18 claims
- 1227US6230962B1Process for cooling soldered objectsFiled 1997·Granted May 15, 2001·1 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →