Inventor · disambiguated record
Heike Marcello
Also filed as: MARCELLO HEIKE
10 granted patents·171 citations·filing 1996–2004
91Inventor score
Files withIBM10
Top patents by PatentIndex Score
10 records- 0180US6706464B2Method of fabricating circuitized structuresIBM·Filed 2003·Granted Mar 16, 2004·15 cites·8 claims
- 0276US6528218B1Method of fabricating circuitized structuresIBM·Filed 2001·Granted Mar 4, 2003·12 cites·8 claims
- 0368US6066889AMethods of selectively filling aperturesIBM·Filed 1998·Granted May 23, 2000·30 cites·10 claims
- 0467US6195264B1Laminate substrate having joining layer of photoimageable materialIBM·Filed 1998·Granted Feb 27, 2001·30 cites·19 claims
- 0566US6519843B2Method of forming a chip carrier by joining a laminate layer and stiffenerIBM·Filed 2001·Granted Feb 18, 2003·12 cites·7 claims
- 0666US6376158B1Methods for selectively filling aperturesIBM·Filed 2000·Granted Apr 23, 2002·11 cites·8 claims
- 0766US5866237AOrganic electronic package and method of applying palladium-tin seed layer theretoIBM·Filed 1996·Granted Feb 2, 1999·27 cites·17 claims
- 0858US6835533B2Photoimageable dielectric epoxy resin system filmIBM·Filed 2004·Granted Dec 28, 2004·5 cites·7 claims
- 0952US6025057AOrganic electronic package and method of applying palladium-tin seed layer theretoIBM·Filed 1997·Granted Feb 15, 2000·15 cites·5 claims
- 1050US6680440B1Circuitized structures produced by the methods of electroless platingIBM·Filed 1998·Granted Jan 20, 2004·14 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →