Inventor · disambiguated record
Heidi M. Meyer
Also filed as: MEYER HEIDI M
6 granted patents·1 pending application·4 citations·filing 2015–2023
77Inventor score
Files withINTEL CORP7
Top patents by PatentIndex Score
7 records- 0187US11881520B2Fin patterning for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Jan 23, 2024·2 cites·10 claims
- 0283US10930753B2Trench isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Feb 23, 2021·1 cites·12 claims
- 0377US11640985B2Trench isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 0473US11837456B2Continuous gate and fin spacer for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 0564US10879241B2Techniques for controlling transistor sub-fin leakageINTEL CORP·Filed 2015·Granted Dec 29, 2020·1 cites·18 claims
- 0655US11462436B2Continuous gate and fin spacer for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Oct 4, 2022·0 cites·14 claims
- 0755US2023207664A1Trench isolation for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →