Inventor · disambiguated record
Henning Mieth
Also filed as: MIETH HENNING
4 granted patents·3 pending applications·4 citations·filing 2001–2008
60Inventor score
Top patents by PatentIndex Score
7 records- 0159US7867817B2Method for manufacturing a wafer level packageQIMONDA AG·Filed 2008·Granted Jan 11, 2011·1 cites·21 claims
- 0242US6605864B2Support matrix for integrated semiconductors, and method for producing itINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 12, 2003·3 cites·10 claims
- 0334US2004159928A1Supporting structure for a chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Application pending·0 cites
- 0433US2008272503A1Semiconductor Device and Method for Making SameMIETH HENNING·Filed 2007·Application pending·0 cites
- 0532US7326593B2Method of producing a package for semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 5, 2008·0 cites·13 claims
- 0630US6979887B2Support matrix with bonding channel for integrated semiconductors, and method for producing itINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 27, 2005·0 cites·8 claims
- 0723US2004022959A1Method of marking substandard partsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →