Inventor · disambiguated record
Heejae Nam
Also filed as: NAM HEEJAE
6 granted patents·3 pending applications·3 citations·filing 2021–2025
70Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0190US11676914B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0281US12015005B2Semiconductor package including non-conductive film and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·1 cites·20 claims
- 0376US2025379133A1Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0475US12451456B2Semiconductor package including non-conductive film and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 0568US12513973B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·10 claims
- 0668US12062626B2Semiconductor substrate and method of sawing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·19 claims
- 0764US12412824B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 0855US2024178000A1Wafer dicing method and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024387460A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →