Inventor · disambiguated record
Herman F. Nied
Also filed as: NIED HERMAN F
11 granted patents·200 citations·filing 1985–1992
91Inventor score
Top patents by PatentIndex Score
11 records- 0184US4818460ARoller forming of thermoplastic sheet materialGEN ELECTRIC·Filed 1987·Granted Apr 4, 1989·49 cites·13 claims
- 0279US5290490AMethod and apparatus for differentially heating and thermoforming a polymer sheetGEN ELECTRIC·Filed 1992·Granted Mar 1, 1994·46 cites·21 claims
- 0376US5200241AMetal-ceramic structure with intermediate high temperature reaction barrier layerGEN ELECTRIC·Filed 1989·Granted Apr 6, 1993·23 cites·11 claims
- 0463US5015169AApparatus for die forming thermoplastic sheet materialGEN ELECTRIC·Filed 1989·Granted May 14, 1991·22 cites·10 claims
- 0562US5290333AMetal-ceramic structure with intermediate high temperature reaction barrier layerGEN ELECTRIC·Filed 1992·Granted Mar 1, 1994·14 cites·8 claims
- 0654US5264819AHigh energy zinc oxide varistorELECTRIC POWER RES INST·Filed 1992·Granted Nov 23, 1993·11 cites·6 claims
- 0747US4943224AApparatus employing integral dielectric heater for roll forming thermoplastic materialGEN ELECTRIC·Filed 1989·Granted Jul 24, 1990·12 cites·9 claims
- 0841US4838974AMethod of forming multilayer composite panels with specular surfaceGEN ELECTRIC·Filed 1988·Granted Jun 13, 1989·14 cites·9 claims
- 0934US4776298AApparatus for performing a plasma enhanced chemical vapor deposition on an edge of a polycarbonate sheetGEN ELECTRIC·Filed 1987·Granted Oct 11, 1988·5 cites·12 claims
- 1031US4737217AMethod of fabricating a substrate for a semiconductor chip packageGEN ELECTRIC·Filed 1986·Granted Apr 12, 1988·3 cites·4 claims
- 1129US4657797ASubstrate for a semiconductor chip package and a method of fabricating the sameGEN ELECTRIC·Filed 1985·Granted Apr 14, 1987·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →