Inventor · disambiguated record
Heung Woo Park
Also filed as: PARK HEUNG-WOO
26 granted patents·27 pending applications·78 citations·filing 2003–2019
94Inventor score
Files withSAMSUNG ELECTRO MECH35PARK HEUNG WOO5KIM JONG WOON4XIA TAI XIN SEMICONDUCTOR QING DAO LTD3LEE HYUN KEE2
Top patents by PatentIndex Score
53 records- 0189US7394139B2Optical modulator module package using flip-chip mounting technologySAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 1, 2008·19 cites·4 claims
- 0285US8973438B2Inertial sensor and method of manufacturing the sameKIM JONG WOON·Filed 2011·Granted Mar 10, 2015·7 cites·15 claims
- 0383US10009523B2Electronic module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 26, 2018·3 cites·20 claims
- 0483US8607638B2Micro electro mechanical systems componentJEUNG WON KYU·Filed 2011·Granted Dec 17, 2013·6 cites·14 claims
- 0579US7227267B2Semiconductor package using flip-chip mounting techniqueSAMSUNG ELECTRO MECH·Filed 2005·Granted Jun 5, 2007·10 cites·3 claims
- 0676US7405867B2Miniature optical modulator module using flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 29, 2008·5 cites·7 claims
- 0772US9120668B2Microphone package and mounting structure thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 1, 2015·2 cites·20 claims
- 0872US7394261B2Semi-conductor chip package capable of detecting open and shortSAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 1, 2008·4 cites·19 claims
- 0971US10636823B2Image sensor assembly, method of manufacturing the same, and camera moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 28, 2020·1 cites·15 claims
- 1062US9052333B2Sensor capable of measuring acceleration, angular velocity, and DC accelerationPARK JUNG TAE·Filed 2012·Granted Jun 9, 2015·2 cites·14 claims
- 1159US10602036B2Electronic module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 24, 2020·0 cites·21 claims
- 1259US7102240B2Embedded integrated circuit packaging structureSAMSUNG ELECTRO MECH·Filed 2004·Granted Sep 5, 2006·9 cites·11 claims
- 1357US2020219761A1Method of forming semiconductor structureXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Application pending·0 cites
- 1455US11170975B2Ion implantation apparatusXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·9 claims
- 1554US7078804B2Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Jul 18, 2006·6 cites·6 claims
- 1654US7012939B2Wavelength stabilization module having light-receiving element array and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2003·Granted Mar 14, 2006·3 cites·10 claims
- 1753US7343072B2Light modulator package having inclined light transmissive lidSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 11, 2008·1 cites·5 claims
- 1852US10923311B1Cathode for ion source comprising a tapered sidewallXIA TAI XIN SEMICONDUCTOR QING DAO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 1952US9236286B2Micro electro mechanical systems sensor module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 12, 2016·0 cites·11 claims
- 2051US8701489B2Inertial sensorKIM JONG WOON·Filed 2011·Granted Apr 22, 2014·0 cites·10 claims
- 2150US9929195B2Image sensor assembly, method of manufacturing the same, and camera moduleSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 27, 2018·0 cites·13 claims
- 2250US2009027752A1Projection display apparatus for removing noiseSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2348US10600835B2Electronic module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 24, 2020·0 cites·12 claims
- 2448US8789417B2Inertial sensor and angular velocity detection method using the sameKIM JONG WOON·Filed 2011·Granted Jul 29, 2014·0 cites·10 claims
- 2547US8739628B2Inertial sensorKIM JONG WOON·Filed 2011·Granted Jun 3, 2014·0 cites·20 claims
- 2646US2015219456A1Angular velocity sensorSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2746US2008316570A1Optical modulator module and temperature sensorSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2846US2009103574A1Laser module package and display apparatus using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2946US2015156575A1Microphone package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3046US2015211884A1Inertial sensor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3145US7529013B2Optical modulator module packageSAMSUNG ELECTRO MECH·Filed 2006·Granted May 5, 2009·0 cites·16 claims
- 3245US2015054173A1Semiconductor package, method of manufacturing semiconductor package and stack type semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3345US2015139467A1Acoustic device and microphone package including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3445US2008317078A1Green laser module packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3545US2015136451A1Electronic component moduleSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3645US2015230028A1Mems microphoneSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3745US2015153378A1Micro electro mechanical systems sensor module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3844US2015145076A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3942US2008158649A1Optical modulator module packageSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 4042US2006078247A1Package structure for optical modulatorSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 4141US2007092179A1MEMS module packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4239US8973230B2Polling method of piezoelectric element and method of manufacturing inertial sensorPARK HEUNG WOO·Filed 2011·Granted Mar 10, 2015·0 cites·11 claims
- 4339US2007075417A1MEMS module package using sealing cap having heat releasing capability and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4438US8505190B2Method of manufacturing inertial sensorLEE HYUN KEE·Filed 2011·Granted Aug 13, 2013·0 cites·12 claims
- 4537US2004076367A1Silicon optical bench for packaging optical switch device, optical switch package using the silicon optical bench, and method for fabricating the silicon optical benchFiled 2003·Application pending·0 cites
- 4635US2013081464A1Inertial sensorPARK HEUNG WOO·Filed 2011·Application pending·0 cites
- 4735US2016353572A1Printed circuit board, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 4834US2013074598A1Inertial sensorPARK HEUNG WOO·Filed 2011·Application pending·0 cites
- 4933US2015249891A1Microphone packageSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 5033US2012125096A1Inertial sensorPARK HEUNG WOO·Filed 2011·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →