Inventor · disambiguated record
Herbert Schwarzbauer
Also filed as: SCHWARZBAUER HERBERT
23 granted patents·5 pending applications·479 citations·filing 1987–2018
96Inventor score
Top patents by PatentIndex Score
28 records- 0191US4810672AMethod of securing electronic components to a substrateSIEMENS AG·Filed 1987·Granted Mar 7, 1989·79 cites·22 claims
- 0287US6324072B1Microelectronic component of sandwich constructionSIEMENS AG·Filed 1999·Granted Nov 27, 2001·53 cites·34 claims
- 0385US7897881B2Arrangement for hermetically sealing components, and method for the production thereofSIEMENS AG·Filed 2006·Granted Mar 1, 2011·14 cites·41 claims
- 0476US6584681B2Method for producing a microelectronic component of sandwich constructionINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jul 1, 2003·17 cites·1 claims
- 0573US5379942AMethod for producing a semiconductor modular structureSIEMENS AG·Filed 1993·Granted Jan 10, 1995·47 cites·4 claims
- 0673US4903885AMethod and apparatus for fastening electronic components to substratesSIEMENS AG·Filed 1989·Granted Feb 27, 1990·35 cites·4 claims
- 0771US5058796AApparatus for fastening electronic components to substratesSIEMENS AG·Filed 1989·Granted Oct 22, 1991·32 cites·2 claims
- 0868US6823915B2Heat-conducting adhesive joint with an adhesive-filled, porous heat conductorSIEMENS AG·Filed 2001·Granted Nov 30, 2004·15 cites·13 claims
- 0967US7402457B2Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfacesSIEMENS AG·Filed 2002·Granted Jul 22, 2008·18 cites·16 claims
- 1067US5654586APower semiconductor component having a buffer layerSIEMENS AG·Filed 1994·Granted Aug 5, 1997·36 cites·2 claims
- 1164US4903886AMethod and apparatus for fastening semiconductor components to substratesSIEMENS AG·Filed 1989·Granted Feb 27, 1990·24 cites·6 claims
- 1261US5072312AThyristor with high positive and negative blocking capabilitySIEMENS AG·Filed 1989·Granted Dec 10, 1991·17 cites·3 claims
- 1357US7057275B2Device with power semiconductor components for controlling the power of high currents and use of said deviceSIEMENS AG·Filed 2002·Granted Jun 6, 2006·8 cites·27 claims
- 1452US8110927B2Explosion-proof module structure for power components, particularly power semiconductor components, and production thereofSCHWARZBAUER HERBERT·Filed 2007·Granted Feb 7, 2012·1 cites·18 claims
- 1552US6776329B2Method for producing a heat-conducting connection between two work piecesSIEMENS AG·Filed 2001·Granted Aug 17, 2004·5 cites·13 claims
- 1650US5893511APressure sintering method for fastening electronic components on a substrateSIEMENS AG·Filed 1996·Granted Apr 13, 1999·16 cites·12 claims
- 1750US5158226AMethod and arrangement for connecting a semiconductor to a substrate or for after-treatment of a semiconductor-to-substrate connection with contact-free pressingSIEMENS AG·Filed 1991·Granted Oct 27, 1992·18 cites·19 claims
- 1848US6559532B1Matrix converterSIEMENS AG·Filed 1999·Granted May 6, 2003·17 cites·8 claims
- 1946US5077224AThyristor with high positive and negative blocking capability and method for the manufacture thereofSIEMENS AG·Filed 1991·Granted Dec 31, 1991·10 cites·6 claims
- 2045US2010133577A1Method for producing electronic component and electronic componentHOFFMANN WERNER·Filed 2008·Application pending·0 cites
- 2144US5663574APower semiconductor component with monolithically integrated sensor arrangement as well as manufacture and employment thereofSIEMENS AKTIENGESELLCHAFT·Filed 1995·Granted Sep 2, 1997·9 cites·9 claims
- 2241US7932585B2Electrical component and film composite laminated on the component and method for productionSIEMENS AG·Filed 2006·Granted Apr 26, 2011·0 cites·20 claims
- 2337US2020207477A1Aircraft having a power electronics componentSIEMENS AG·Filed 2018·Application pending·0 cites
- 2436US2012028025A1Electrical or electronic composite component and method for producing an electrical or electronic composite componentWOLDE-GIORGIS DANIEL·Filed 2009·Application pending·0 cites
- 2535US5067647AApparatus for fastening semiconductor components to substratesSIEMENS AG·Filed 1989·Granted Nov 26, 1991·5 cites·2 claims
- 2634US2008001244A1System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said SystemSCHWARZBAUER HERBERT·Filed 2005·Application pending·0 cites
- 2733US6175148B1Electrical connection for a power semiconductor componentSIEMENS AG·Filed 1999·Granted Jan 16, 2001·3 cites·16 claims
- 2828US2012075826A1pressure support for an electronic circuitKASPAR MICHAEL·Filed 2010·Application pending·0 cites
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