Inventor · disambiguated record
Hengrong Shi
Also filed as: Shi Hengrong
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withCXMT CORP3
Top patents by PatentIndex Score
3 records- 0162US2025079375A1Package structure and semiconductor structureCXMT CORP·Filed 2024·Application pending·0 cites
- 0258US2025364389A1Package structure, semiconductor structure, and electronic deviceCXMT CORP·Filed 2024·Application pending·0 cites
- 0342US2025096106A1Package structure and semiconductor structureCXMT CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →