Inventor · disambiguated record
Heun Gun Shin
Also filed as: SHIN HEUN GUN
2 granted patents·7 pending applications·4 citations·filing 2015–2024
39Inventor score
Top patents by PatentIndex Score
9 records- 0171US11026327B2Printed circuit boardLG INNOTEK CO LTD·Filed 2018·Granted Jun 1, 2021·4 cites·11 claims
- 0259US2025359089A1Pillar with embedded capacitorQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0355US2025192099A1Integrated circuit(ic) package having a substrate employing reduced area, added metal pad(s) to metal interconnect(s) to reduce die-substrate clearanceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0455US2025316612A1Trench shielding with photoimageable dielectric (pid) materialQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0552US2025309135A1Electromagnetic interference shielding for integrated circuit devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0649US2025316605A1Interconnect including conductor in photo-imageable dielectric layerQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0748US2025226328A1Multilayer coreless substrate formed from stacked embedded trace substratesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0848US2025259937A1Square thermal viaQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0928US9801275B2Printed circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →