Inventor · disambiguated record
Hee Ju Son
Also filed as: SON HEE JU
6 granted patents·8 pending applications·5 citations·filing 2009–2025
71Inventor score
Top patents by PatentIndex Score
14 records- 0185US11145462B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 12, 2021·2 cites·16 claims
- 0276US11049654B2Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 29, 2021·1 cites·6 claims
- 0371US11587736B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 21, 2023·0 cites·30 claims
- 0470US2025328082A1Apparatus and method for manufacturing pattern structure with three-dimensional pattern geometry by using photoreactive polymer composition, and pattern structure manufactured therebyUNIV KOREA RES & BUS FOUND·Filed 2025·Application pending·0 cites
- 0562US11049656B2Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 29, 2021·0 cites·10 claims
- 0661US8114303B2Method of manufacturing ceramic probe cardPARK HO JOON·Filed 2009·Granted Feb 14, 2012·2 cites·12 claims
- 0758US2010116676A1Method of fabricating probe pin for probe cardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0846US2010039129A1Probe cardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0946US2010040984A1Method of fabricating micro electro-mechanical componentSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1040US2010073436A1Ink-jet headSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1137US8765078B2Biochip stamping device and stamping method thereofJEON SANG YOUL·Filed 2012·Granted Jul 1, 2014·0 cites·12 claims
- 1237US2013081450A1Device for testing droplets and operating method thereofSON HEE JU·Filed 2012·Application pending·0 cites
- 1336US2012153054A1Micro-ejecting apparatusKIM SANG JIN·Filed 2011·Application pending·0 cites
- 1432US2013099023A1Fluid ejection deviceJEON SANG YOUL·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →