Inventor · disambiguated record
Herbert I. Stoller
Also filed as: STOLLER HERBERT I
23 granted patents·911 citations·filing 1979–2008
97Inventor score
Top patents by PatentIndex Score
23 records- 0198US6072690AHigh k dielectric capacitor with low k sheathed signal viasIBM·Filed 1998·Granted Jun 6, 2000·152 cites·7 claims
- 0292US4688151AMultilayered interposer board for powering high current chip modulesIBM·Filed 1986·Granted Aug 18, 1987·119 cites·6 claims
- 0391US6430030B2High k dielectric material with low k dielectric sheathed signal viasIBM·Filed 2001·Granted Aug 6, 2002·34 cites·4 claims
- 0491US6023407AStructure for a thin film multilayer capacitorIBM·Filed 1998·Granted Feb 8, 2000·80 cites·26 claims
- 0589US6878608B2Method of manufacture of silicon based packageIBM·Filed 2001·Granted Apr 12, 2005·54 cites·16 claims
- 0689US6037044ADirect deposit thin film single/multi chip moduleIBM·Filed 1998·Granted Mar 14, 2000·68 cites·24 claims
- 0785US7855442B2Silicon based packageIBM·Filed 2007·Granted Dec 21, 2010·10 cites·7 claims
- 0881US6200400B1Method for making high k dielectric material with low k dielectric sheathed signal viasIBM·Filed 1999·Granted Mar 13, 2001·34 cites·8 claims
- 0979US7189595B2Method of manufacture of silicon based package and devices manufactured therebyIBM·Filed 2004·Granted Mar 13, 2007·21 cites·9 claims
- 1079US6216324B1Method for a thin film multilayer capacitorIBM·Filed 1999·Granted Apr 17, 2001·37 cites·36 claims
- 1176US8097492B2Method and manufacture of silicon based package and devices manufactured therebyMAGERLEIN JOHN H·Filed 2008·Granted Jan 17, 2012·7 cites·10 claims
- 1276US5635761AInternal resistor termination in multi-chip module environmentsIBM·Filed 1994·Granted Jun 3, 1997·57 cites·19 claims
- 1372US6261467B1Direct deposit thin film single/multi chip moduleIBM·Filed 1999·Granted Jul 17, 2001·26 cites·11 claims
- 1471US7193318B2Multiple power density chip structureIBM·Filed 2004·Granted Mar 20, 2007·18 cites·13 claims
- 1571US5060116AElectronics system with direct write engineering change capabilityGROBMAN WARREN D·Filed 1990·Granted Oct 22, 1991·57 cites·39 claims
- 1669US6713686B2Apparatus and method for repairing electronic packagesIBM·Filed 2002·Granted Mar 30, 2004·16 cites·20 claims
- 1766US6762489B2Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modulesIBM·Filed 2001·Granted Jul 13, 2004·12 cites·14 claims
- 1864US5243140ADirect distribution repair and engineering change systemIBM·Filed 1991·Granted Sep 7, 1993·33 cites·13 claims
- 1962US4252581ASelective epitaxy method for making filamentary pedestal transistorIBM·Filed 1979·Granted Feb 24, 1981·19 cites·5 claims
- 2061US6392896B1Semiconductor package containing multiple memory unitsIBM·Filed 1999·Granted May 21, 2002·24 cites·12 claims
- 2153US4535388AHigh density wired moduleIBM·Filed 1984·Granted Aug 13, 1985·16 cites·5 claims
- 2250US6974722B2Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modulesIBM·Filed 2004·Granted Dec 13, 2005·4 cites·3 claims
- 2348US4546413AEngineering change facility on both major surfaces of chip moduleIBM·Filed 1984·Granted Oct 8, 1985·13 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →