Inventor · disambiguated record
Hengkang Wu
Also filed as: Wu hengkang
1 granted patent·6 pending applications·0 citations·filing 2022–2024
10Inventor score
Top patents by PatentIndex Score
7 records- 0163US12490381B2Circuit board assemblyTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·16 claims
- 0254US2024396266A1Connector and Device Comprising the SameTYCO ELECTRONICS HOLDINGS BERMUDA NO 7 LTD·Filed 2024·Application pending·0 cites
- 0354US2024429659A1Grounding Member and Manufacturing Method of it, Grounding Assembly, Connector and Terminal ModuleTYCO ELECTRONICS HOLDINGS BERMUDA NO 7 LTD·Filed 2024·Application pending·0 cites
- 0452US2024364055A1Connector and Device Comprising the SameTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2024·Application pending·0 cites
- 0552US2024364034A1ConnectorTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2024·Application pending·0 cites
- 0652US2024364028A1Connector and Connector AssemblyTYCO ELECTRONICS SHANGHAI CO LTD·Filed 2024·Application pending·0 cites
- 0751US2024283198A1Electrical ConnectorTYCO ELECTRONICS HOLDINGS BERMUDA NO 7 LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →