Inventor · disambiguated record
Heng-Shen Yeh
Also filed as: YEH HENG-SHEN
7 granted patents·4 pending applications·0 citations·filing 2021–2025
69Inventor score
Files withINNOLUX CORP11
Top patents by PatentIndex Score
11 records- 0173US2024421060A1Electronic deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 0272US2025038089A1Electronic deviceINNOLUX CORP·Filed 2024·Application pending·0 cites
- 0370US12424454B2Composite layer circuit elementINNOLUX CORP·Filed 2023·Granted Sep 23, 2025·0 cites·1 claims
- 0470US2025273551A1Package structureINNOLUX CORP·Filed 2025·Application pending·0 cites
- 0566US11764077B2Composite layer circuit element and manufacturing method thereofINNOLUX CORP·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 0665US12148685B2Redistribution layer structureINNOLUX CORP·Filed 2021·Granted Nov 19, 2024·0 cites·17 claims
- 0765US12107036B2Redistribution layer structure and manufacturing method thereofINNOLUX CORP·Filed 2021·Granted Oct 1, 2024·0 cites·16 claims
- 0862US12322686B2Redistribution layer structureINNOLUX CORP·Filed 2021·Granted Jun 3, 2025·0 cites·11 claims
- 0957US12191197B2Manufacturing method of package structure of electronic deviceINNOLUX CORP·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 1053US12315741B2Method of manufacturing electronic device with reduced substrate warpageINNOLUX CORP·Filed 2022·Granted May 27, 2025·0 cites·18 claims
- 1152US2024128184A1Electronic device and manufacturing method thereofINNOLUX CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →