Inventor · disambiguated record
Hidenori Abe
Also filed as: ABE HIDENORI
18 granted patents·2 pending applications·489 citations·filing 1993–2020
95Inventor score
Top patents by PatentIndex Score
20 records- 0197US6198208B1Thin film piezoelectric deviceTDK CORP·Filed 2000·Granted Mar 6, 2001·165 cites·3 claims
- 0296US6989723B2Piezoelectric resonant filter and duplexerTDK CORP·Filed 2003·Granted Jan 24, 2006·133 cites·20 claims
- 0391US9234263B2WeldmentKURODA HIROMITSU·Filed 2011·Granted Jan 12, 2016·10 cites·3 claims
- 0487US6709776B2Multilayer thin film and its fabrication process as well as electron deviceTDK CORP·Filed 2001·Granted Mar 23, 2004·36 cites·14 claims
- 0584US12459449B2Wire harness routing structure for chargeable vehicleNISSAN MOTOR·Filed 2020·Granted Nov 4, 2025·2 cites·5 claims
- 0681US10674612B2Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layerHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jun 2, 2020·3 cites·8 claims
- 0780US6372351B1Encapsulant epoxy resin composition and electronic deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Apr 16, 2002·46 cites·14 claims
- 0879US11330721B2Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin filmHITACHI CHEMICAL CO LTD·Filed 2020·Granted May 10, 2022·1 cites·7 claims
- 0970US11147166B2Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 12, 2021·1 cites·6 claims
- 1069US5302877ASurface acoustic wave deviceNIPPON MINING CO·Filed 1993·Granted Apr 12, 1994·22 cites·20 claims
- 1162US6855996B2Electronic device substrate structure and electronic deviceTDK CORP·Filed 2003·Granted Feb 15, 2005·9 cites·12 claims
- 1255US7220995B2Substrate for electronic device, electronic device and methods of manufacturing sameTDK CORP·Filed 2004·Granted May 22, 2007·8 cites·9 claims
- 1353US5850167ASurface acoustic wave deviceKINSEKI LIMITED·Filed 1996·Granted Dec 15, 1998·15 cites·24 claims
- 1452US5434465ASurface acoustic wave deviceNIKKO KYONDO CO LTD·Filed 1994·Granted Jul 18, 1995·14 cites·28 claims
- 1550US5585684ASurface acoustic wave deviceJAPAN ENERGY CORP·Filed 1995·Granted Dec 17, 1996·13 cites·20 claims
- 1646US9809872B2Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wireAOYAMA SEIGI·Filed 2010·Granted Nov 7, 2017·0 cites·16 claims
- 1746US2009286083A1Copper wire for a magnet wire, magnet wire using same, and method for fabricating copper wire for a magnet wireHITACHI CABLE·Filed 2009·Application pending·0 cites
- 1837US6259187B1Piezoelectric bulk acoustic wave deviceTDK CORP·Filed 1999·Granted Jul 10, 2001·5 cites·14 claims
- 1935US5877661ASurface acoustic wave filter with optimally sized gaps between transducersKINSEKI LIMITED·Filed 1996·Granted Mar 2, 1999·6 cites·15 claims
- 2035US2002006733A1Multilayer thin film and its fabrication process as well as electron deviceTDK CORP·Filed 2001·Application pending·0 cites
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