Inventor · disambiguated record
Hisahiko Abe
Also filed as: ABE HISAHIKO
9 granted patents·3 pending applications·101 citations·filing 1997–2005
88Inventor score
Top patents by PatentIndex Score
12 records- 0191US7070477B2Method of polishing semiconductor waferHITACHI LTD·Filed 2005·Granted Jul 4, 2006·30 cites·8 claims
- 0277US6579754B2Semiconductor memory device having ferroelectric film and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jun 17, 2003·15 cites·12 claims
- 0371US6239457B1Semiconductor memory device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted May 29, 2001·28 cites·19 claims
- 0456US6514864B2Fabrication method for semiconductor integrated circuit deviceHITACHI LTD·Filed 2001·Granted Feb 4, 2003·7 cites·24 claims
- 0551US6468817B2Semiconductor integrated circuit device manufacturing method including chemical mechanical polishing, and detection and evaluation of microscratches caused therebyHITACHI LTD·Filed 2001·Granted Oct 22, 2002·4 cites·12 claims
- 0651US6445025B2Semiconductor memory device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Sep 3, 2002·2 cites·6 claims
- 0750US6326216B1Process for producing semiconductor integrated circuit deviceHITACHI LTD·Filed 1997·Granted Dec 4, 2001·13 cites·55 claims
- 0842US6995058B2Semiconductor memory device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Feb 7, 2006·0 cites·12 claims
- 0940US2002048941A1Process for producing semiconductor integrated circuit deviceFiled 2001·Application pending·0 cites
- 1039US6979650B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Dec 27, 2005·2 cites·12 claims
- 1136US2003124858A1Fabrication method for semiconductor integrated circuit deviceFiled 2002·Application pending·0 cites
- 1228US2002155650A1Fabrication method of semiconductor integrated circuit deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →