Inventor · disambiguated record
Hisashi Akachi
Also filed as: AKACHI HISASHI
2 granted patents·1 pending application·5 citations·filing 2002–2009
50Inventor score
Files withSEIKO EPSON CORP3
Top patents by PatentIndex Score
3 records- 0151US6878609B2Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break patternSEIKO EPSON CORP·Filed 2003·Granted Apr 12, 2005·4 cites·20 claims
- 0243US6699552B2Silicon wafer break pattern, silicon substrateSEIKO EPSON CORP·Filed 2002·Granted Mar 2, 2004·1 cites·26 claims
- 0337US2009223270A1Press, method for manufacturing the metal plate, method for manufacturing the liquid spray head, method for manufacturing the liquid spray apparatusSEIKO EPSON CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →