Inventor · disambiguated record
Hideo Aoki
Also filed as: AOKI HIDEO
115 granted patents·20 pending applications·2,299 citations·filing 1974–2022
99Inventor score
Top patents by PatentIndex Score
135 records- 0199US7553756B2Process for producing semiconductor integrated circuit deviceHITACHI LTD·Filed 2006·Granted Jun 30, 2009·222 cites·20 claims
- 0298US7860988B2Congestion control and avoidance method in a data processing systemHITACHI LTD·Filed 2008·Granted Dec 28, 2010·210 cites·21 claims
- 0396US8485653B2Compact front-operable image forming apparatusKATSUYAMA GORO·Filed 2011·Granted Jul 16, 2013·10 cites·7 claims
- 0495US7589151B2Thermoplastic resin composition and molded article comprising the sameMITSUBISHI RAYON CO·Filed 2005·Granted Sep 15, 2009·34 cites·10 claims
- 0595US7469981B2Compact front-operable image forming apparatusRICOH KK·Filed 2003·Granted Dec 30, 2008·49 cites·19 claims
- 0695US5892273ASemiconductor package integral with semiconductor chipTOSHIBA KK·Filed 1995·Granted Apr 6, 1999·194 cites·63 claims
- 0795US5041872AImage forming apparatus using a photosensitive drum selectively pivoting with an upper part of the housingRICOH KK·Filed 1989·Granted Aug 20, 1991·59 cites·18 claims
- 0893US6028360ASemiconductor integrated circuit device in which a conductive film is formed over a trap film which in turn is formed over a titanium filmHITACHI LTD·Filed 1998·Granted Feb 22, 2000·101 cites·2 claims
- 0993US4875063AElectrostatic recording apparatusRICOH KK·Filed 1987·Granted Oct 17, 1989·58 cites·11 claims
- 1091US7411301B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Aug 12, 2008·16 cites·20 claims
- 1190US6340632B1Method of manufacturing a semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 22, 2002·44 cites·37 claims
- 1288US7373459B2Congestion control and avoidance method in a data processing systemHITACHI LTD·Filed 2005·Granted May 13, 2008·14 cites·9 claims
- 1388US6215144B1Semiconductor integrated circuit device, and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Apr 10, 2001·73 cites·19 claims
- 1487US10497688B2Semiconductor device having stacked logic and memory chipsTOSHIBA MEMORY CORP·Filed 2018·Granted Dec 3, 2019·5 cites·19 claims
- 1587US7772692B2Semiconductor device with cooling memberTOSHIBA KK·Filed 2007·Granted Aug 10, 2010·15 cites·21 claims
- 1687US6399438B2Method of manufacturing semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 2001·Granted Jun 4, 2002·32 cites·17 claims
- 1786US5804479AMethod for forming semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 1996·Granted Sep 8, 1998·58 cites·25 claims
- 1885US8152294B2Compact front-operable image forming apparatusKATSUYAMA GORO·Filed 2008·Granted Apr 10, 2012·5 cites·16 claims
- 1985US7029750B2Thermoplastic resin composition and production method thereofMITSUBISHI RAYON CO·Filed 2003·Granted Apr 18, 2006·35 cites·11 claims
- 2085US6812127B2Method of forming semiconductor device including silicon oxide with fluorine, embedded wiring layer, via holes, and wiring groovesRENESAS TECH CORP·Filed 2001·Granted Nov 2, 2004·44 cites·5 claims
- 2183US7130912B2Data communication system using priority queues with wait count information for determining whether to provide services to client requestsHITACHI LTD·Filed 2002·Granted Oct 31, 2006·39 cites·15 claims
- 2283US6555464B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Apr 29, 2003·25 cites·21 claims
- 2383US5202275ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·43 cites·23 claims
- 2482US6742701B2Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatusTAMURA SEISAKUSHO KK·Filed 2002·Granted Jun 1, 2004·26 cites·31 claims
- 2582US5786271AProduction of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor packageTOSHIBA KK·Filed 1996·Granted Jul 28, 1998·85 cites·3 claims
- 2681US10861812B2Electronic apparatusTOSHIBA MEMORY CORP·Filed 2019·Granted Dec 8, 2020·3 cites·18 claims
- 2781US5578849ASemiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitanceHITACHI LTD·Filed 1994·Granted Nov 26, 1996·35 cites·14 claims
- 2880US5866950ASemiconductor package and fabrication methodTOSHIBA KK·Filed 1996·Granted Feb 2, 1999·60 cites·8 claims
- 2979US5780882ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1995·Granted Jul 14, 1998·33 cites·8 claims
- 3077US8409919B2Method for manufacturing semiconductor deviceAOKI HIDEO·Filed 2010·Granted Apr 2, 2013·6 cites·16 claims
- 3177US8191758B2Method for manufacturing semiconductor deviceSAWADA KANAKO·Filed 2010·Granted Jun 5, 2012·5 cites·14 claims
- 3277US4970552AToner contamination preventive meansRICOH KK·Filed 1988·Granted Nov 13, 1990·20 cites·2 claims
- 3376US7282434B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Oct 16, 2007·4 cites·11 claims
- 3476US6548847B2Semiconductor integrated circuit device having a first wiring strip exposed through a connecting hole, a transition-metal film in the connecting hole and an aluminum wiring strip thereover, and a transition-metal nitride film between the aluminum wiring strip and the transition-metal filmHITACHI LTD·Filed 2001·Granted Apr 15, 2003·12 cites·33 claims
- 3576US6329681B1Semiconductor integrated circuit device and method of manufacturing the sameFiled 1998·Granted Dec 11, 2001·38 cites·18 claims
- 3675US11250951B2Feature engineering method, apparatus, and systemHITACHI LTD·Filed 2018·Granted Feb 15, 2022·2 cites·14 claims
- 3775US6856019B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Feb 15, 2005·14 cites·9 claims
- 3875US6605530B2Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2002·Granted Aug 12, 2003·14 cites·24 claims
- 3975US5121168AImage forming apparatus having a used toner storage portionRICOH KK·Filed 1991·Granted Jun 9, 1992·24 cites·7 claims
- 4073US7531876B2Semiconductor device having power semiconductor elementsTOSHIBA KK·Filed 2005·Granted May 12, 2009·6 cites·14 claims
- 4173US7370412B2Method for connecting electronic deviceTOSHIBA KK·Filed 2003·Granted May 13, 2008·21 cites·6 claims
- 4273US7023091B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Apr 4, 2006·13 cites·11 claims
- 4373US5331191ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Jul 19, 1994·24 cites·11 claims
- 4473US4941015ADevice for screening a photoconductive element unit from external lightRICOH KK·Filed 1988·Granted Jul 10, 1990·19 cites·5 claims
- 4572US6160308ASemiconductor deviceTOSHIBA KK·Filed 2000·Granted Dec 12, 2000·19 cites·5 claims
- 4672US5128744ASemiconductor integrated circuit and method of manufacturing sameHITACHI LTD·Filed 1989·Granted Jul 7, 1992·38 cites·34 claims
- 4771US7977238B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 12, 2011·2 cites·16 claims
- 4871US6853081B2Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2003·Granted Feb 8, 2005·11 cites·18 claims
- 4969US3961031AMethod for removal of mercury in sulfur dioxide-containing gasNIPPON MINING CO·Filed 1974·Granted Jun 1, 1976·24 cites·7 claims
- 5068US7623816B2Belt conveyance apparatus and image forming apparatus using such a belt conveyance apparatusRICOH KK·Filed 2004·Granted Nov 24, 2009·11 cites·26 claims
Showing the top 50 of 135 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →