Inventor · disambiguated record
Hidemitsu Aoki
Also filed as: AOKI HIDEMITSU
70 granted patents·9 pending applications·1,713 citations·filing 1995–2010
99Inventor score
Top patents by PatentIndex Score
79 records- 0195US6683007B1Etching and cleaning methods and etching and cleaning apparatus used thereforNEC CORP·Filed 2000·Granted Jan 27, 2004·68 cites·28 claims
- 0292US5616221AElectrolytic ionized water producing apparatusNEC CORP·Filed 1995·Granted Apr 1, 1997·91 cites·14 claims
- 0391US6423148B1Substrate-cleaning method and substrate-cleaning solutionNEC CORP·Filed 1999·Granted Jul 23, 2002·94 cites·15 claims
- 0490US6869921B2Stripping compositionNEC ELECTRONICS CORP·Filed 2002·Granted Mar 22, 2005·48 cites·44 claims
- 0590US5676760AMethod for wet processing of a semiconductor substrateNEC CORP·Filed 1995·Granted Oct 14, 1997·113 cites·13 claims
- 0689US6787480B2Manufacturing method of semicondcutor deviceNEC CORP·Filed 2002·Granted Sep 7, 2004·49 cites·3 claims
- 0787US6465352B1Method for removing dry-etching residue in a semiconductor device fabricating processNEC CORP·Filed 2000·Granted Oct 15, 2002·38 cites·22 claims
- 0887US6444583B2Substrate-cleaning method and substrate-cleaning solutionNEC CORP·Filed 2001·Granted Sep 3, 2002·30 cites·15 claims
- 0987US5762779AMethod for producing electrolyzed waterNEC CORP·Filed 1995·Granted Jun 9, 1998·84 cites·11 claims
- 1087US5635053AMethod and apparatus for cleaning electronic partsNEC CORP·Filed 1995·Granted Jun 3, 1997·90 cites·21 claims
- 1185US6890391B2Method of manufacturing semiconductor device and apparatus for cleaning substrateNEC ELECTRONICS CORP·Filed 2003·Granted May 10, 2005·33 cites·10 claims
- 1284US6964724B2Etching and cleaning methods and etching and cleaning apparatuses used thereforNEC ELECTRONICS CORP·Filed 2003·Granted Nov 15, 2005·21 cites·4 claims
- 1384US6592677B1Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutionsNEC ELECTRONICS CORP·Filed 2000·Granted Jul 15, 2003·31 cites·13 claims
- 1483US7138362B2Washing liquid composition for semiconductor substrateNEC ELECTRONICS CORP·Filed 2003·Granted Nov 21, 2006·23 cites·12 claims
- 1582US6524376B2Anticorrosive agentNEC CORP·Filed 2001·Granted Feb 25, 2003·32 cites·5 claims
- 1681US7862658B2Etching and cleaning methods and etching and cleaning apparatuses used thereforRENESAS ELECTRONICS CORP·Filed 2005·Granted Jan 4, 2011·5 cites·9 claims
- 1781US6225217B1Method of manufacturing semiconductor device having multilayer wiringNEC CORP·Filed 1999·Granted May 1, 2001·52 cites·10 claims
- 1879US5578193AMethod and apparatus for wet treatment of solid surfacesNEC CORP·Filed 1995·Granted Nov 26, 1996·56 cites·33 claims
- 1978US6387190B1Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiringNEC CORP·Filed 1999·Granted May 14, 2002·45 cites·21 claims
- 2078US5833831AMethod and system for generating electrolyzed waterNEC CORP·Filed 1997·Granted Nov 10, 1998·55 cites·10 claims
- 2177US5599438AMethod for producing electrolyzed waterNEC CORP·Filed 1996·Granted Feb 4, 1997·54 cites·4 claims
- 2276US7312186B2Cleaning solution for semiconductor substrateKANTO KAGAKU·Filed 2004·Granted Dec 25, 2007·19 cites·9 claims
- 2375US5989919AMethod for analyzing contamination within hole in semiconductor deviceNEC CORP·Filed 1997·Granted Nov 23, 1999·43 cites·9 claims
- 2475US5543030AMethod for producing electrolyzed waterNEC CORP·Filed 1995·Granted Aug 6, 1996·42 cites·7 claims
- 2574US8129287B2Method for manufacturing semiconductor device and semiconductor deviceSUZUKI TATSUYA·Filed 2008·Granted Mar 6, 2012·3 cites·16 claims
- 2674US7560372B2Process for making a semiconductor device having a roughened surfaceNEC ELECTRONICS CORP·Filed 2006·Granted Jul 14, 2009·5 cites·9 claims
- 2774US7087562B2Post-CMP washing liquid compositionNEC ELECTRONICS CORP·Filed 2003·Granted Aug 8, 2006·16 cites·5 claims
- 2874US6080709ACleaning solution for cleaning substrates to which a metallic wiring has been appliedKANTO KAGAKU·Filed 1998·Granted Jun 27, 2000·43 cites·10 claims
- 2973US6833109B1Method and apparatus for storing a semiconductor wafer after its CMP polishingNEC ELECTRONICS CORP·Filed 2000·Granted Dec 21, 2004·16 cites·24 claims
- 3072US6998352B2Cleaning method, method for fabricating semiconductor device and cleaning solutionNEC ELECTRONICS CORP·Filed 2002·Granted Feb 14, 2006·14 cites·24 claims
- 3172US6864187B2Method of washing a semiconductor waferNEC ELECTRONICS CORP·Filed 2002·Granted Mar 8, 2005·14 cites·22 claims
- 3272US6787293B2Photoresist residue remover compositionKANTO KAGAKU·Filed 2003·Granted Sep 7, 2004·15 cites·6 claims
- 3372US6036581ASubstrate cleaning method and apparatusNEC CORP·Filed 1998·Granted Mar 14, 2000·40 cites·8 claims
- 3471US6992050B2Stripping agent composition and method of strippingNEC CORP·Filed 2001·Granted Jan 31, 2006·17 cites·10 claims
- 3570US7170172B2Semiconductor device having a roughened surfaceNEC ELECTRONICS CORP·Filed 2002·Granted Jan 30, 2007·14 cites·16 claims
- 3668US6890864B2Semiconductor device fabricating method and treating liquidNEC ELECTRONICS CORP·Filed 2003·Granted May 10, 2005·12 cites·27 claims
- 3767US6319801B1Method for cleaning a substrate and cleaning solutionNEC CORP·Filed 1998·Granted Nov 20, 2001·33 cites·16 claims
- 3866US7368064B2Cleaning solution and manufacturing method for semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted May 6, 2008·2 cites·7 claims
- 3966US7186354B2Anticorrosive treating concentrateSUMITOMO CHEMICAL CO·Filed 2001·Granted Mar 6, 2007·10 cites·27 claims
- 4066US6897150B1Semiconductor wafer surface and method of treating a semiconductor wafer surfaceNEC ELECTRONICS CORP·Filed 2000·Granted May 24, 2005·13 cites·37 claims
- 4165US7402530B2Method for manufacturing semiconductor device and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jul 22, 2008·1 cites·13 claims
- 4265US7268087B2Manufacturing method of semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Sep 11, 2007·10 cites·5 claims
- 4365US6767409B2Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiringNEC ELECTRONICS CORP·Filed 2002·Granted Jul 27, 2004·8 cites·16 claims
- 4464US7592266B2Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Sep 22, 2009·1 cites·8 claims
- 4563US8420549B2Etching and cleaning methods and etching and cleaning apparatuses used thereforYAMASAKI SHINYA·Filed 2010·Granted Apr 16, 2013·1 cites·22 claims
- 4661US7312160B2Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Granted Dec 25, 2007·6 cites·17 claims
- 4761US6797648B2Cleaning water for cleaning a wafer and method of cleaning a waferNEC ELECTRONICS CORP·Filed 2002·Granted Sep 28, 2004·7 cites·12 claims
- 4861US6624061B2Semiconductor device and method of manufacturing the same capable of reducing deterioration of low dielectric constant filmNEC ELECTRONICS CORP·Filed 1999·Granted Sep 23, 2003·26 cites·11 claims
- 4960US6183351B1Method of supplying a chemical mechanical polishing liquid and apparatus thereforNEC CORP·Filed 1999·Granted Feb 6, 2001·23 cites·16 claims
- 5060US6136708AMethod for manufacturing semiconductor deviceNEC CORP·Filed 1999·Granted Oct 24, 2000·22 cites·33 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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