Inventor · disambiguated record
Hisako Aoyama
Also filed as: AOYAMA HISAKO
7 granted patents·1 pending application·237 citations·filing 1994–2009
85Inventor score
Top patents by PatentIndex Score
8 records- 0193US5592024ASemiconductor device having a wiring layer with a barrier layerTOSHIBA KK·Filed 1994·Granted Jan 7, 1997·133 cites·5 claims
- 0291US6794286B2Process for fabricating a metal wiring and metal contact in a semicondutor deviceTOSHIBA KK·Filed 2000·Granted Sep 21, 2004·55 cites·11 claims
- 0374US6090699AMethod of making a semiconductor deviceTOSHIBA KK·Filed 1996·Granted Jul 18, 2000·35 cites·6 claims
- 0460US7075098B2Method of selecting pattern to be measured, pattern inspection method, manufacturing method of semiconductor device, program, and pattern inspection apparatusTOSHIBA KK·Filed 2003·Granted Jul 11, 2006·3 cites·20 claims
- 0549US7862965B2Method for detecting defects which originate from chemical solution and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Jan 4, 2011·0 cites·5 claims
- 0648US6060368AMask pattern correction methodTOSHIBA KK·Filed 1998·Granted May 9, 2000·11 cites·16 claims
- 0746US8097169B2Method for filtering chemicalKAWAMURA YOSHIHISA·Filed 2009·Granted Jan 17, 2012·0 cites·20 claims
- 0840US2007010028A1Chemical solution qualification method, semiconductor device fabrication method, and liquid crystal display manufacturing methodKONDOH TAKEHIRO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →