Inventor · disambiguated record
Hiroshi Asami
Also filed as: ASAMI HIROSHI
44 granted patents·9 pending applications·579 citations·filing 1974–2024
98Inventor score
Top patents by PatentIndex Score
53 records- 0194US7728431B2Electronic component, semiconductor device employing same, and method for manufacturing electronic componentSONY CORP·Filed 2007·Granted Jun 1, 2010·39 cites·2 claims
- 0292US4141001AMonitor display control method and apparatus for data input unitFUJITSU LTD·Filed 1977·Granted Feb 20, 1979·61 cites·10 claims
- 0391US5361588ACryogenic refrigeratorSUMITOMO HEAVY INDUSTRIES·Filed 1992·Granted Nov 8, 1994·81 cites·2 claims
- 0490US9379155B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2015·Granted Jun 28, 2016·5 cites·16 claims
- 0588US6156242AMethod of injection molding plastic lensHOYA CORP·Filed 1998·Granted Dec 5, 2000·62 cites·12 claims
- 0686US10050074B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2016·Granted Aug 14, 2018·3 cites·20 claims
- 0783US11315970B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2018·Granted Apr 26, 2022·2 cites·18 claims
- 0883US7421777B2Method of manufacturing multilayer wiring substrate using temporary metal support layerSONY CORP·Filed 2005·Granted Sep 9, 2008·12 cites·6 claims
- 0981US9041179B2Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2014·Granted May 26, 2015·3 cites·5 claims
- 1080US4065374AMethod and apparatus for plating under constant current densityNEW NIPPON ELECTRIC CO·Filed 1977·Granted Dec 27, 1977·38 cites·8 claims
- 1179US8252628B2Semiconductor device and method of manufacturing the sameNABE YOSHIHIRO·Filed 2008·Granted Aug 28, 2012·6 cites·6 claims
- 1278US11676977B2Semiconductor deviceSONY GROUP CORP·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
- 1378US7420127B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2006·Granted Sep 2, 2008·6 cites·14 claims
- 1475US4120759AConstant current density plating methodNEW NIPPON ELECTRIC CO·Filed 1977·Granted Oct 17, 1978·29 cites·6 claims
- 1573US8455969B2Semiconductor device and method for manufacturing the sameNABE YOSHIHIRO·Filed 2008·Granted Jun 4, 2013·7 cites·22 claims
- 1673US3965913ACash dispensing systemFUJITSU LTD·Filed 1974·Granted Jun 29, 1976·21 cites·21 claims
- 1771US6210610B1Method of manufacturing lens, injection mold for molding of lens, and molded lensHOYA CORP·Filed 1997·Granted Apr 3, 2001·29 cites·24 claims
- 1868US11886047B2Spectacle lenses and methods for producing the sameASAMI HIROSHI·Filed 2022·Granted Jan 30, 2024·0 cites·8 claims
- 1968US6831357B2Circuit substrate device, method for producing the same, semiconductor device and method for producing the sameSONY CORP·Filed 2003·Granted Dec 14, 2004·11 cites·4 claims
- 2068US5972252AInjection compression molding method of a spectacle lens and a spectacle lens produced by using the sameHOYA CORP·Filed 1996·Granted Oct 26, 1999·28 cites·7 claims
- 2167US7691672B2Substrate treating method and method of manufacturing semiconductor apparatusSONY CORP·Filed 2007·Granted Apr 6, 2010·4 cites·10 claims
- 2264US5481879ARefrigerator having regeneratorSUMITOMO HEAVY INDUSTRIES·Filed 1994·Granted Jan 9, 1996·27 cites·32 claims
- 2363US8146243B2Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit boardASAMI HIROSHI·Filed 2009·Granted Apr 3, 2012·3 cites·13 claims
- 2463US5590533ARefrigerator having regeneratorSUMITOMO HEAVY INDUSTRIES·Filed 1995·Granted Jan 7, 1997·27 cites·10 claims
- 2562US2024329211A1Photodetection device and manufacturing method thereofDENSO CORP·Filed 2024·Application pending·0 cites
- 2661US11598977B2Spectacle lenses and methods for producing the sameASAMI HIROSHI·Filed 2018·Granted Mar 7, 2023·0 cites·15 claims
- 2761US5948327ALens injection-compression-molding methodHOYA CORP·Filed 1997·Granted Sep 7, 1999·21 cites·11 claims
- 2859US12140821B2Progressive addition lens and design method thereforHOYA LENS THAILAND LTD·Filed 2019·Granted Nov 12, 2024·0 cites·9 claims
- 2959US8263871B2Mount board and semiconductor moduleASAMI HIROSHI·Filed 2009·Granted Sep 11, 2012·1 cites·7 claims
- 3059USRE38617EMethod of injection molding plastic lensHOYA CORP·Filed 1997·Granted Oct 12, 2004·20 cites·37 claims
- 3157US12099260B2Progressive addition lens and design method thereforHOYA LENS THAILAND LTD·Filed 2019·Granted Sep 24, 2024·0 cites·9 claims
- 3257US2023221417A1Laser radar deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 3354US7053315B2Junction structure and junction method for conductive projectionSONY CORP·Filed 2004·Granted May 30, 2006·8 cites·6 claims
- 3452US7138294B2Circuit substrate device, method for producing the same, semiconductor device and method for producing the sameSONY CORP·Filed 2004·Granted Nov 21, 2006·3 cites·20 claims
- 3552US2012286387A1Semiconductor device and method of manufacturing the sameNABE YOSHIHIRO·Filed 2012·Application pending·0 cites
- 3651US2007293038A1Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2007·Application pending·0 cites
- 3750US2022003973A1Imaging optical systemDENSO CORP·Filed 2021·Application pending·0 cites
- 3849US8684523B2Spectacle lens, spectacle lens design method, and design apparatusWADA OSAMU·Filed 2012·Granted Apr 1, 2014·0 cites·10 claims
- 3949US7939360B2Semiconductor device and manufacturing method thereforSONY CORP·Filed 2009·Granted May 10, 2011·0 cites·7 claims
- 4047US9918388B2Circuit substrate, method of manufacturing circuit substrate, and electronic componentSONY CORP·Filed 2013·Granted Mar 13, 2018·0 cites·7 claims
- 4146US2012205817A1Manufacturing method of semiconductor device and semiconductor deviceASAMI HIROSHI·Filed 2012·Application pending·0 cites
- 4244US10288903B2Progressive addition lensKAGA TADASHI·Filed 2015·Granted May 14, 2019·0 cites·13 claims
- 4344US2010244270A1Manufacturing method of semiconductor device and semiconductor deviceSONY CORP·Filed 2010·Application pending·0 cites
- 4443US10401649B2Method of designing progressive refractive power lens, and lens setHOYA LENS THAILAND LTD·Filed 2016·Granted Sep 3, 2019·0 cites·4 claims
- 4543US2007057022A1Component mounting method and component-mounted bodySONY CORP·Filed 2006·Application pending·0 cites
- 4642US8987899B2Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor deviceASAMI HIROSHI·Filed 2012·Granted Mar 24, 2015·0 cites·10 claims
- 4741US10545354B2Designing method and designing device for progressive power lensHOYA LENS THAILAND LTD·Filed 2016·Granted Jan 28, 2020·0 cites·5 claims
- 4840US7288724B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2003·Granted Oct 30, 2007·0 cites·2 claims
- 4940US4831845ATemperature testing device provided with sample-receiving chamber from which a specimen is easily detachable and in which temperature is controllableYASUKAGE ODA·Filed 1988·Granted May 23, 1989·12 cites·4 claims
- 5039US10870725B2Heat curable resin composition, and circuit board with electronic component mounted thereonSAN EI KAGAKU CO·Filed 2017·Granted Dec 22, 2020·0 cites·5 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →