Inventor · disambiguated record
Hiroaki Ashidate
Also filed as: ASHIDATE HIROAKI
13 granted patents·12 pending applications·38 citations·filing 2014–2024
86Inventor score
Top patents by PatentIndex Score
25 records- 0195US9679867B2Semiconductor device having a low-adhesive bond substrate pairTOSHIBA KK·Filed 2015·Granted Jun 13, 2017·15 cites·10 claims
- 0294US10090351B2Semiconductor device having gaps within the conductive partsTOSHIBA MEMORY CORP·Filed 2017·Granted Oct 2, 2018·11 cites·23 claims
- 0393US10109508B2Substrate processing device and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Oct 23, 2018·10 cites·10 claims
- 0470US11069700B2Semiconductor storage device and method of manufacturing the sameTOSHIBA MEMORY CORP·Filed 2019·Granted Jul 20, 2021·1 cites·11 claims
- 0569US10978316B2Semiconductor processing deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Apr 13, 2021·1 cites·2 claims
- 0667US12444681B2Semiconductor device and method for manufacturing the sameKIOXIA CORP·Filed 2022·Granted Oct 14, 2025·0 cites·16 claims
- 0765US12438111B2Semiconductor device, wafer, and wafer manufacturing methodKIOXIA CORP·Filed 2022·Granted Oct 7, 2025·0 cites·6 claims
- 0863US12046487B2Substrate treatment apparatus and substrate treatment methodKIOXIA CORP·Filed 2021·Granted Jul 23, 2024·0 cites·4 claims
- 0963US12027380B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2021·Granted Jul 2, 2024·0 cites·11 claims
- 1062US2024324195A1Semiconductor device manufacturing methodKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1160US12400981B2Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Granted Aug 26, 2025·0 cites·14 claims
- 1260US9269734B2Method of manufacturing solid-state imaging deviceTOSHIBA KK·Filed 2014·Granted Feb 23, 2016·0 cites·3 claims
- 1360US2025029956A1Semiconductor memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1458US2015115388A1Solid-state imaging device and manufacturing method of solid-state imaging deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1556US2023395499A1Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1655US2023395498A1Semiconductor storage device and manufacturing method thereofKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1755US2023411344A1Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1855US2023397425A1Semiconductor storage device, method of manufacturing semiconductor storage device, and semiconductor waferKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1953US12400995B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2052US2019385867A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Application pending·0 cites
- 2148US2017309501A1Substrate treatment apparatus and substrate treatment methodTOSHIBA MEMORY CORP·Filed 2016·Application pending·0 cites
- 2243US11171020B2Substrate treatment apparatusTOSHIBA MEMORY CORP·Filed 2019·Granted Nov 9, 2021·0 cites·2 claims
- 2338US2018233383A1Substrate treatment apparatus and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Application pending·0 cites
- 2434US2016035766A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2534US2016126087A1Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →