Inventor · disambiguated record
Himanshu A. Bal
Also filed as: BAL HIMANSHU A
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Files withADVANCED MICRO DEVICES INC3
Top patents by PatentIndex Score
3 records- 0159US2025357365A1Chip package assembly with surface mounted component protectionADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0257US2025157864A1Integrated circuit device with raised lid attach areaADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0355US2025006496A1Removing conductive material from a pedestal of a semiconductor lid outside of an area contacting a dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →