Inventor · disambiguated record

Hing Suan Cheam

Also filed as: CHEAM HING SUAN

0 granted patents·2 pending applications·0 citations·filing 2023–2023

Technology areasH10W

Files withNexperia BV2

Top patents by PatentIndex Score

2 records

0146US2023326835A1Molded electronic package and method for manufacturing the sameNexperia BV·Filed 2023·Application pending·0 cites
0238US2023402355A1Electronic package with heatsink and manufacturing method thereforNexperia BV·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →