Inventor · disambiguated record
Hirofumi Fujii
Also filed as: FUJII HIROFUMI
75 granted patents·24 pending applications·1,021 citations·filing 1982–2024
99Inventor score
Top patents by PatentIndex Score
99 records- 0196US7258912B2Hard laminated film, method of manufacturing the same and film-forming deviceKOBE STEEL LTD·Filed 2005·Granted Aug 21, 2007·45 cites·10 claims
- 0295US5410180AMetal plane support for multi-layer lead frames and a process for manufacturing such framesSHINKO ELECTRIC IND CO·Filed 1993·Granted Apr 25, 1995·220 cites·26 claims
- 0394US6662442B1Process for manufacturing printed wiring board using metal plating techniquesNITTO DENKO CORP·Filed 2000·Granted Dec 16, 2003·100 cites·7 claims
- 0492US6767627B2Hard film, wear-resistant object and method of manufacturing wear-resistant objectKOBE STEEL LTD·Filed 2002·Granted Jul 27, 2004·52 cites·20 claims
- 0591US9165212B1Person counting device, person counting system, and person counting methodPANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 20, 2015·8 cites·9 claims
- 0691US6591491B2Method for producing multilayer circuit boardNITTO DENKO CORP·Filed 2001·Granted Jul 15, 2003·53 cites·2 claims
- 0789US6379159B1Interposer for chip size package and method for manufacturing the sameNITTO DENKO CORP·Filed 2000·Granted Apr 30, 2002·40 cites·11 claims
- 0888US8639045B2Image processing device and image processing methodYOKOMITSU SUMIO·Filed 2010·Granted Jan 28, 2014·9 cites·8 claims
- 0988US8355046B2Object tracing device, object tracing system, and object tracing methodPANASONIC CORP·Filed 2005·Granted Jan 15, 2013·12 cites·12 claims
- 1088US7235888B2Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Jun 26, 2007·15 cites·13 claims
- 1186US9693023B2Monitoring apparatus, monitoring system, and monitoring methodPANASONIC IP MAN CO LTD·Filed 2015·Granted Jun 27, 2017·5 cites·22 claims
- 1285US6334405B1Vacuum arc evaporation source and vacuum arc vapor deposition apparatusKOBE STEEL LTD·Filed 2000·Granted Jan 1, 2002·23 cites·10 claims
- 1384US8133365B2Method of arc ion plating and target for use thereinFUJII HIROFUMI·Filed 2007·Granted Mar 13, 2012·6 cites·3 claims
- 1483US7575812B2Cleaning substrate of substrate processing equipment and heat resistant resin preferable thereforNITTO DENKO CORP·Filed 2005·Granted Aug 18, 2009·7 cites·11 claims
- 1583US7371506B2Positive photosensitive resin compositionNITTO DENKO CORP·Filed 2006·Granted May 13, 2008·7 cites·4 claims
- 1682US9025875B2People counting device, people counting method and people counting programMATSUMOTO YUICHI·Filed 2011·Granted May 5, 2015·7 cites·18 claims
- 1781US6904674B2Process for manufacturing a printed wiring boardNITTO DENKO CORP·Filed 2002·Granted Jun 14, 2005·23 cites·4 claims
- 1880US8026045B2Method of manufacturing wiring circuit boardNITTO DENKO CORP·Filed 2008·Granted Sep 27, 2011·5 cites·2 claims
- 1979US11773202B2Curable compound, curable composition, and method for producing curable compositionNITTO SHINKO CORP·Filed 2020·Granted Oct 3, 2023·1 cites·3 claims
- 2078US9760808B2Image processing system, server device, image pickup device and image evaluation methodPANASONIC CORP·Filed 2013·Granted Sep 12, 2017·3 cites·3 claims
- 2176US8197647B2Hard laminated film, method of manufacturing the same and film-forming deviceYAMAMOTO KENJI·Filed 2007·Granted Jun 12, 2012·2 cites·13 claims
- 2275US9200360B2Arc evaporation source and film forming method using the sameTANIFUJI SHINICHI·Filed 2010·Granted Dec 1, 2015·4 cites·28 claims
- 2375US8907985B2Image display device and image display methodFUJII HIROFUMI·Filed 2010·Granted Dec 9, 2014·3 cites·6 claims
- 2474US5237202ALead frame and semiconductor device using sameSHINKO ELECTRIC IND CO·Filed 1991·Granted Aug 17, 1993·52 cites·19 claims
- 2573US7955673B2PVD cylindrical targetKOBE STEEL LTD·Filed 2007·Granted Jun 7, 2011·2 cites·7 claims
- 2673US7910631B2Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin compositionNITTO DENKO CORP·Filed 2008·Granted Mar 22, 2011·6 cites·6 claims
- 2773US6956603B2Moving object detecting method, apparatus and computer program productMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Oct 18, 2005·19 cites·25 claims
- 2871US9374528B2Panoramic expansion image display device and method of displaying panoramic expansion imageWATANABE TAKESHI·Filed 2011·Granted Jun 21, 2016·2 cites·20 claims
- 2970US5291060ALead frame and semiconductor device using sameSHINKO ELECTRIC IND CO·Filed 1992·Granted Mar 1, 1994·43 cites·20 claims
- 3070US4524351ASmoke detectorNITTAN CO LTD·Filed 1982·Granted Jun 18, 1985·32 cites·8 claims
- 3169US9560321B2Image capturing system, camera control device for use therein, image capturing method, camera control method, and computer programFUJIMATSU TAKESHI·Filed 2012·Granted Jan 31, 2017·5 cites·17 claims
- 3267US6772515B2Method of producing multilayer printed wiring boardHITACHI LTD·Filed 2001·Granted Aug 10, 2004·12 cites·3 claims
- 3366US12174577B2Image forming apparatusFUJII HIROFUMI·Filed 2023·Granted Dec 24, 2024·0 cites·11 claims
- 3466US7876419B2Exposure apparatus and device manufacturing methodCANON KK·Filed 2007·Granted Jan 25, 2011·2 cites·8 claims
- 3566US5730847AArc ion plating device and arc ion plating systemKOBE STEEL LTD·Filed 1994·Granted Mar 24, 1998·43 cites·22 claims
- 3665US12116432B2Curable compositionNITTO SHINKO CORP·Filed 2020·Granted Oct 15, 2024·0 cites·8 claims
- 3764US8541099B2Heat-resistant resinFUJII HIROFUMI·Filed 2009·Granted Sep 24, 2013·1 cites·8 claims
- 3864US8244684B2Report searching apparatus and a method for searching a reportANDO YUTAKA·Filed 2008·Granted Aug 14, 2012·1 cites·13 claims
- 3964US6858473B2Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor deviceNITTO DENKO CORP·Filed 2003·Granted Feb 22, 2005·12 cites·14 claims
- 4064US6746816B2Photosensitive resin composition and circuit boardNITTO DENKO CORP·Filed 2001·Granted Jun 8, 2004·7 cites·14 claims
- 4164US5235209AMulti-layer lead frame for a semiconductor device with contact geometrySHINKO ELECTRIC IND CO·Filed 1991·Granted Aug 10, 1993·36 cites·10 claims
- 4264US2025152758A1Probe for nuclear medical testingUNIV TOKYO·Filed 2023·Application pending·0 cites
- 4363US12024578B2Curable compositionNITTO SHINKO CORP·Filed 2020·Granted Jul 2, 2024·0 cites·4 claims
- 4463US10992174B2Monitoring control systemTOSHIBA ENERGY SYSTEMS & SOLUTIONS CORP·Filed 2018·Granted Apr 27, 2021·1 cites·12 claims
- 4562US7793668B2Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2004·Granted Sep 14, 2010·5 cites·18 claims
- 4659US9897489B2Processing apparatus and method of measuring temperature of workpiece in processing apparatusKOBE STEEL LTD·Filed 2014·Granted Feb 20, 2018·0 cites·7 claims
- 4759US2015136029A1Film deposition systemKOBE STEEL LTD·Filed 2014·Application pending·0 cites
- 4857US9147121B2Person detection device and person detection methodPANASONIC CORP·Filed 2013·Granted Sep 29, 2015·1 cites·4 claims
- 4957US6889426B2Method for manufacturing wired circuit boardNITTO DENKO CORP·Filed 2002·Granted May 10, 2005·6 cites·1 claims
- 5057US2016002769A1Pvd processing apparatus and pvd processing methodKOBE STEEL LTD·Filed 2014·Application pending·0 cites
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →