Inventor · disambiguated record
Hidenori Fujii
Also filed as: FUJII HIDENORI
29 granted patents·12 pending applications·42 citations·filing 1998–2024
93Inventor score
Top patents by PatentIndex Score
41 records- 0185US7800204B2Semiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Sep 21, 2010·10 cites·15 claims
- 0277US11456376B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Sep 27, 2022·1 cites·12 claims
- 0373US8841175B2Vertical trench IGBT and method for manufacturing the sameFUJII HIDENORI·Filed 2012·Granted Sep 23, 2014·3 cites·7 claims
- 0470US10510904B2Semiconductor device with backside N-type layer at active region/termination region boundary and extending into action regionMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Dec 17, 2019·2 cites·10 claims
- 0568US8420496B2Semiconductor device and method of fabricating the sameFUJII HIDENORI·Filed 2010·Granted Apr 16, 2013·2 cites·6 claims
- 0662US2025240992A1Semiconductor device, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0760US2025151299A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0858US8829519B2Semiconductor deviceFUJII HIDENORI·Filed 2008·Granted Sep 9, 2014·2 cites·19 claims
- 0957US2024203830A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1055US6372531B1Semiconductor device and fabrication process thereforMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 16, 2002·6 cites·7 claims
- 1155US2025212435A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1255US2024047454A1Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1354US12328933B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Jun 10, 2025·0 cites·14 claims
- 1454US9054039B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jun 9, 2015·0 cites·5 claims
- 1553US6914308B2Vertical PNP bipolar transistorRENESAS TECH CORP·Filed 2002·Granted Jul 5, 2005·6 cites·8 claims
- 1651US10763760B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 1, 2020·0 cites·12 claims
- 1750US11107887B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 31, 2021·0 cites·10 claims
- 1850US9508872B2Method for manufacturing semiconductor device and pin diodeMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Nov 29, 2016·0 cites·14 claims
- 1950US2023083162A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2049US9240358B2Semiconductor device provided with temperature sensing diode and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 19, 2016·0 cites·14 claims
- 2149US6225180B1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted May 1, 2001·4 cites·4 claims
- 2248US8872346B2Semiconductor deviceFUJII HIDENORI·Filed 2011·Granted Oct 28, 2014·0 cites·2 claims
- 2348US2022084825A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2448US2008230452A1Spool valveDENSO CORP·Filed 2008·Application pending·0 cites
- 2548US2022157809A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2647US11715789B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Aug 1, 2023·0 cites·11 claims
- 2747US11575001B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Feb 7, 2023·0 cites·19 claims
- 2846US2006266443A1Forged pistonHONDA MOTOR CO LTD·Filed 2006·Application pending·0 cites
- 2946US2013313949A1Rotary actuatorDENSO CORP·Filed 2013·Application pending·0 cites
- 3045US11830872B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 28, 2023·0 cites·19 claims
- 3142US10892329B2Method for manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 12, 2021·0 cites·8 claims
- 3240US9991212B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 5, 2018·0 cites·8 claims
- 3339US10546961B2Semiconductor device with non-overlapping impurity layersMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jan 28, 2020·0 cites·13 claims
- 3439US9960158B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted May 1, 2018·0 cites·8 claims
- 3539US7241660B2Manufacturing method of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Jul 10, 2007·0 cites·2 claims
- 3638US6404039B1Semiconductor device with intrinsic base diffusion layer, extrinsic base diffusion layer, and common base diffusionMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jun 11, 2002·6 cites·6 claims
- 3738US2007018283A1Zener diodeMITSUBISHI ELECTRIC CORP·Filed 2006·Application pending·0 cites
- 3837US10234029B2Controller of oil pressure control system for automatic transmissionDENSO CORP·Filed 2016·Granted Mar 19, 2019·0 cites·6 claims
- 3935US6730981B2Bipolar transistor with inclined epitaxial layerRENESAS TECH CORP·Filed 2002·Granted May 4, 2004·0 cites·8 claims
- 4034US6707130B2Bipolar device with polycrystalline film contact and resistanceRENESAS TECH CORP·Filed 2002·Granted Mar 16, 2004·0 cites·8 claims
- 4129US6114742ASemiconductor device including crystal defectMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Sep 5, 2000·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →