Inventor · disambiguated record
Hideyuki Fujimoto
Also filed as: FUJIMOTO HIDEYUKI
12 granted patents·4 pending applications·85 citations·filing 1982–2023
89Inventor score
Files withNICHIA CORP7DOWA ELECTRONICS MATERIALS CO LTD4FUJIMOTO HIDEYUKI1MASUI SHINGO1MITSUBISHI RAYON CO1
Top patents by PatentIndex Score
16 records- 0196US11329449B2Semiconductor laser deviceNICHIA CORP·Filed 2020·Granted May 10, 2022·4 cites·18 claims
- 0295US11728617B2Semiconductor laser deviceNICHIA CORP·Filed 2022·Granted Aug 15, 2023·2 cites·12 claims
- 0394US10490970B2Semiconductor laser deviceNICHIA CORP·Filed 2018·Granted Nov 26, 2019·7 cites·7 claims
- 0492US10199796B2Semiconductor laser deviceNICHIA CORP·Filed 2017·Granted Feb 5, 2019·5 cites·8 claims
- 0591US10734784B2Semiconductor laser deviceNICHIA CORP·Filed 2019·Granted Aug 4, 2020·5 cites·12 claims
- 0688US4466701AHighly reliable electrooptical device and process for manufacturing the sameOPTREX KK·Filed 1982·Granted Aug 21, 1984·56 cites·8 claims
- 0782US12142892B2Semiconductor laser deviceNICHIA CORP·Filed 2023·Granted Nov 12, 2024·0 cites·10 claims
- 0864US8995492B2Semiconductor laser elementMASUI SHINGO·Filed 2012·Granted Mar 31, 2015·2 cites·20 claims
- 0963US9780523B2Semiconductor laser deviceNICHIA CORP·Filed 2015·Granted Oct 3, 2017·1 cites·19 claims
- 1057US6890991B2Thermoplastic resin compositionMITSUBISHI RAYON CO·Filed 2001·Granted May 10, 2005·3 cites·6 claims
- 1151US10458004B2Silver-bismuth powder, conductive paste and conductive filmDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Oct 29, 2019·0 cites·6 claims
- 1248US12048964B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Jul 30, 2024·0 cites·17 claims
- 1346US2013250987A1Semiconductor laser deviceFUJIMOTO HIDEYUKI·Filed 2013·Application pending·0 cites
- 1445US2020094318A1Bonding material and bonding method employing sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Application pending·0 cites
- 1539US2003227838A1Optical disk and optical disk recording/reproducing apparatusPIONEER CORP·Filed 2003·Application pending·0 cites
- 1637US2020035637A1Bonding material and bonded product using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →