Inventor · disambiguated record
Hiromichi Gohara
Also filed as: GOHARA HIROMICHI
47 granted patents·6 pending applications·181 citations·filing 2006–2022
97Inventor score
Files withFUJI ELECTRIC CO LTD44GOHARA HIROMICHI4FUJI ELECTRIC HOLDINGS2HONDA MOTOR CO LTD2NIPPON LIGHT METAL CO1
Top patents by PatentIndex Score
53 records- 0196US9472488B2Semiconductor device and cooler thereofFUJI ELECTRIC CO LTD·Filed 2013·Granted Oct 18, 2016·33 cites·8 claims
- 0293US12074091B2Semiconductor device with cooler including heat dissipating substrate having a plurality of fins bonded to reinforcing plateFUJI ELECTRIC CO LTD·Filed 2021·Granted Aug 27, 2024·2 cites·7 claims
- 0393US11501980B2Semiconductor module, method for manufacturing semiconductor module, and level different jigFUJI ELECTRIC CO LTD·Filed 2020·Granted Nov 15, 2022·3 cites·22 claims
- 0493US10971431B2Semiconductor device, cooling module, power converting device, and electric vehicleFUJI ELECTRIC CO LTD·Filed 2019·Granted Apr 6, 2021·10 cites·12 claims
- 0591US10214109B2Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicleFUJI ELECTRIC CO LTD·Filed 2014·Granted Feb 26, 2019·14 cites·15 claims
- 0691US8933557B2Semiconductor module and cooling unitGOHARA HIROMICHI·Filed 2010·Granted Jan 13, 2015·17 cites·12 claims
- 0790US9237676B2Semiconductor module cooler and semiconductor moduleGOHARA HIROMICHI·Filed 2012·Granted Jan 12, 2016·13 cites·15 claims
- 0890US8902589B2Semiconductor module and coolerGOHARA HIROMICHI·Filed 2011·Granted Dec 2, 2014·13 cites·22 claims
- 0989US11581252B2Semiconductor module and wire bonding methodFUJI ELECTRIC CO LTD·Filed 2021·Granted Feb 14, 2023·2 cites·8 claims
- 1089US9245821B2Cooling device for semiconductor module, and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2012·Granted Jan 26, 2016·9 cites·19 claims
- 1188US9673130B2Semiconductor device having a coolerFUJI ELECTRIC CO LTD·Filed 2016·Granted Jun 6, 2017·6 cites·16 claims
- 1287US9960100B2Cooler and semiconductor module using sameFUJI ELECTRIC CO LTD·Filed 2015·Granted May 1, 2018·7 cites·12 claims
- 1387US9673129B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Jun 6, 2017·6 cites·9 claims
- 1483US11444004B2CoolerFUJI ELECTRIC CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·9 claims
- 1583US11075144B2Cooler and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Jul 27, 2021·2 cites·11 claims
- 1682US11908772B2Semiconductor module and vehicleFUJI ELECTRIC CO LTD·Filed 2021·Granted Feb 20, 2024·1 cites·18 claims
- 1780USD903612SSemiconductor moduleFUJI ELECTRIC CO LTD·Filed 2019·Granted Dec 1, 2020·17 cites·1 claims
- 1880US10128167B2Semiconductor module and manufacturing method of semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2017·Granted Nov 13, 2018·3 cites·18 claims
- 1979US9220182B2Semiconductor module cooler and semiconductor moduleHONDA MOTOR CO LTD·Filed 2013·Granted Dec 22, 2015·5 cites·29 claims
- 2078US11582889B2Semiconductor module and vehicleFUJI ELECTRIC CO LTD·Filed 2020·Granted Feb 14, 2023·1 cites·15 claims
- 2174US10192807B2Power semiconductor module, flow path member, and power-semiconductor-module structureFUJI ELECTRIC CO LTD·Filed 2017·Granted Jan 29, 2019·2 cites·23 claims
- 2272US12148631B2Semiconductor module, method for manufacturing semiconductor module, and level different jigFUJI ELECTRIC CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·19 claims
- 2372US10128345B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Nov 13, 2018·2 cites·13 claims
- 2471US9704779B2Semiconductor module cooler and method for manufacturing sameFUJI ELECTRIC CO LTD·Filed 2016·Granted Jul 11, 2017·2 cites·9 claims
- 2568US9263367B2Semiconductor deviceHONDA MOTOR CO LTD·Filed 2014·Granted Feb 16, 2016·2 cites·19 claims
- 2667US11624562B2Heat sinkFUJI ELECTRIC CO LTD·Filed 2022·Granted Apr 11, 2023·0 cites·4 claims
- 2767US10332845B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Jun 25, 2019·1 cites·10 claims
- 2864US9871006B2Semiconductor module having a solder-bonded cooling unitFUJI ELECTRIC CO LTD·Filed 2016·Granted Jan 16, 2018·1 cites·8 claims
- 2963US10461012B2Semiconductor module with reinforcing boardFUJI ELECTRIC CO LTD·Filed 2016·Granted Oct 29, 2019·1 cites·13 claims
- 3062US9293391B2Semiconductor module cooler and semiconductor moduleGOHARA HIROMICHI·Filed 2012·Granted Mar 22, 2016·1 cites·10 claims
- 3160US2021102760A1Heat sinkFUJI ELECTRIC CO LTD·Filed 2020·Application pending·0 cites
- 3256US2023245948A1Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 3353US12249556B2Cooler and semiconductor apparatusFUJI ELECTRIC CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·16 claims
- 3453US11315854B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·12 claims
- 3552US12087655B2Semiconductor apparatus and vehicleFUJI ELECTRIC CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 3651US11664296B2Semiconductor module and vehicleFUJI ELECTRIC CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 3750US12127382B2Semiconductor module with cooling fins in a matrix formFUJI ELECTRIC CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·14 claims
- 3850US11387210B2Semiconductor module and manufacturing method thereforFUJI ELECTRIC CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·12 claims
- 3949US2022278039A1Semiconductor module and method for manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 4049US2009136663A1Vacuum vapor deposition apparatus and method, and vapor deposited article formed therewithFUJI ELECTRIC HOLDINGS·Filed 2008·Application pending·0 cites
- 4147US11996350B2Cooler and semiconductor apparatusFUJI ELECTRIC CO LTD·Filed 2021·Granted May 28, 2024·0 cites·10 claims
- 4247US10916491B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·15 claims
- 4346US10468333B2Cooling apparatus, semiconductor module, and vehicleFUJI ELECTRIC CO LTD·Filed 2019·Granted Nov 5, 2019·0 cites·15 claims
- 4446US2007085086A1Organic light emitting deviceFUJI ELECTRIC HOLDINGS·Filed 2006·Application pending·0 cites
- 4545USD983759SSemiconductor moduleFUJI ELECTRIC CO LTD·Filed 2019·Granted Apr 18, 2023·3 cites·1 claims
- 4645US2015008574A1Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Application pending·0 cites
- 4744US9978664B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2017·Granted May 22, 2018·0 cites·27 claims
- 4843US12072155B2Heat exchanger having cured edgeNIPPON LIGHT METAL CO·Filed 2021·Granted Aug 27, 2024·0 cites·16 claims
- 4943US11158563B2Power semiconductor module and vehicleFUJI ELECTRIC CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·14 claims
- 5042US10446460B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Oct 15, 2019·0 cites·16 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →