Inventor · disambiguated record
Hiroyuki Hanazono
Also filed as: HANAZONO HIROYUKI
13 granted patents·18 pending applications·35 citations·filing 2007–2015
88Inventor score
Top patents by PatentIndex Score
31 records- 0188US8768114B2Opto-electric hybrid board and method of manufacturing sameNITTO DENKO CORP·Filed 2013·Granted Jul 1, 2014·10 cites·4 claims
- 0282US8837874B2Opto-electric hybrid board and method of manufacturing sameNITTO DENKO CORP·Filed 2013·Granted Sep 16, 2014·6 cites·6 claims
- 0382US8822834B2Printed circuit board and method of manufacturing the sameINOUE SHINICHI·Filed 2011·Granted Sep 2, 2014·3 cites·8 claims
- 0479US10014235B2Underfill material, laminated sheet and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jul 3, 2018·3 cites·5 claims
- 0578US9288903B2Printed circuit board and method of manufacturing the sameHASEGAWA MINEYOSHI·Filed 2011·Granted Mar 15, 2016·6 cites·12 claims
- 0674US8511142B2Substance detection sensorYAMAZAKI HIROSHI·Filed 2009·Granted Aug 20, 2013·3 cites·1 claims
- 0770US8438726B2Method of manufacturing printed circuit boardINOUE SHINICHI·Filed 2011·Granted May 14, 2013·2 cites·12 claims
- 0864US9679797B2Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jun 13, 2017·1 cites·4 claims
- 0963US9366815B2Opto-electric hybrid boardNITTO DENKO CORP·Filed 2013·Granted Jun 14, 2016·1 cites·2 claims
- 1060US8776579B2Substance detection sensorNITTO DENKO CORP·Filed 2013·Granted Jul 15, 2014·0 cites·1 claims
- 1156US2010047653A1Printed circuit board and fuel cellNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1253US8642686B2Paste composition and printed circuit boardINOUE SHINICHI·Filed 2011·Granted Feb 4, 2014·0 cites·5 claims
- 1348US8522428B2Method for producing a sensor boardHANAZONO HIROYUKI·Filed 2009·Granted Sep 3, 2013·0 cites·5 claims
- 1446US2007272434A1Printed circuit board and manufacturing method thereofNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1545US2011076522A1Printed circuit board and fuel cellNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1645US2011126900A1Dye-sensitized solar cell electrode and dye-sensitized solar cellNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1745US2011189508A1Printed circuit board and fuel cell including the sameNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1844US2016240394A1Semiconductor Device Manufacturing MethodNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1944US2016240523A1Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin CompositionNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2044US2016233184A1Semiconductor Device Manufacturing MethodNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2144US2011111264A1Printed circuit board and fuel cellNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2243US2016035640A1Underfill film, sealing sheet, method of manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2343US2016013089A1Semiconductor device production method, sheet-shaped resin composition, dicing tape-integrated sheet-shaped resin compositionNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2443US2016075871A1Thermosetting resin composition and method for producing a semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2542US2016040045A1Adhesive film for underfill, adhesive film for underfill integrated with tape for grinding rear surface, adhesive film for underfill integrated with dicing tape, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2642US2011023947A1Dye-sensitized solar cell electrode and dye-sensitized solar cellNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2742US2015380277A1Underfill sheet, underfill sheet integrated with tape for grinding rear surface, underfill sheet integrated with dicing tape, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2841US2011048511A1Dye-sensitized solar cellNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2941US2011108106A1Dye-sensitized solar cell electrode and dye-sensitized solar cellNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3035US2011281202A1Printed circuit board, fuel cell and method of manufacturing printed circuit boardHANAZONO HIROYUKI·Filed 2011·Application pending·0 cites
- 3133US10141217B2Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Nov 27, 2018·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →