Inventor · disambiguated record

Hidefumi Hayashi

Also filed as: HAYASHI HIDEFUMI

1 granted patent·1 pending application·10 citations·filing 2001–2006

32Inventor score

Technology areasH10W

Files withALMT CORP2

Top patents by PatentIndex Score

2 records

0158US7083759B2Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2001·Granted Aug 1, 2006·10 cites·7 claims
0239US2006246314A1Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2006·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →